We search for industry news, so you don't need to.
Press Releases

March 6, 2017  -  Click the title to read the full press release.

AT&S advances PCB, module and packaging technologies
For years, AT&S has worked at the forefront of process and technology development to meet the challenges of continued miniaturization and the demand for better energy ...

AT&S
June 20, 2018
AT&S offers interconnection technologies for next-generation 5G mobile communications
Significantly higher data rates and volumes together with high power densities are resulting in rising requirements for interconnection technologies, too. The new 5G ...
May 4, 2018
AT&S offers a look into the future of connection technology: From the PCB to the all-in-one package
In Velden (Austria), AT&S presented innovative technologies and trends in connection solutions at the 14th AT&S Technology Forum. Numerous interested customers ...
March 6, 2017
AT&S advances PCB, module and packaging technologies
For years, AT&S has worked at the forefront of process and technology development to meet the challenges of continued miniaturization and the demand for better energy ...