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Press Releases

January 11, 2017  -  Click the title to read the full press release.

Indium Corporation Experts to Present at Pan Pacific Microelectronics Symposium 2017
Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, and Tim Jensen, Senior Product Manager for Engineered Solders Materials ...

Indium Corporation
June 19, 2017
Indium Corporation Expert to Present at Microelectronics Tech Asia Singapore
Indium Corporation's Jason Chou, Area Technical Manager for Taiwan, will share his technical expertise at Microelectronics Tech Asia Singapore, July 4-5, 2017 in Singapore. ...
June 13, 2017
Indium Features WS-575-C Ball-Attach Flux at Microelectronics Tech Asia Singapore
Indium Corporation will feature its WS-575-C Ball-Attach Flux at Microelectronics Tech Asia Singapore, July 4-5, 2017 in Singapore. Indium Corporation's WS-575-C ...
June 7, 2017
Germanium Solder Preforms at IMAPS High Temperature Electronics Network (HiTEN) 2017
Indium Corporation will feature its semiconductor-grade gold-germanium solder preforms at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 ...
June 6, 2017
Indium Expert to Present at IMAPS High Temperature Electronics Network (HiTEN) 2017
Indium Corporation's Bernard Leavitt, Product Specialist, High-Temperature Applications, will present at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017) ...
May 31, 2017
Indium Expert to Present at China Semiconductor Packaging Test Symposium 2017
Indium Corporation's Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China. Hu's ...
May 26, 2017
Indium's Mackie to Present at IMAPS ATW on Advances in Semiconductor Packaging
Indium Corporation's Andy C. Mackie, PhD, MSc, Senior Product Manager for Semiconductor and Advanced Assembly Materials, will present at the IMAPS Advanced ...
May 4, 2017
Indium to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium
Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC's 15th Annual MEMS and Sensors Technology Symposium on June 6 ...
April 19, 2017
Indium Corporation Expert to Present at RaMP 2017 Workshop
Indium Corporation's Karthik Vijay, Technical Manager for Europe, Africa, and the Middle East, will present at the RF and Microwave Packaging (RaMP) 2017 Workshop ...
April 6, 2017
Indium Corporation Features Reclaim and Recycle Program at SVC TechCon 2017
Indium Corporation will feature its reclaim and recycle program at the Society of Vacuum Coaters 2017 Technical Conference (SVC TechCon) April 29-May 4 in Providence ...
February 24, 2017
Indium Corporation's Durham to Share Expertise at IMAPS Device Packaging
Indium Corporation's Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will share her expertise at IMAPS 13th International ...