Press Release - Engineered Material Systems, Inc.
January 9, 2017  -  Click the title to read the full press release.

EMS Debuts Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging



Engineered Material Systems, Inc. is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level ...

Engineered Material Systems, Inc.
December 6, 2017
Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Engineered Material Systems, Inc. announces the availability of 5 µm thick dry-film negative photoresists for use in micro-electro mechanical systems (MEMS), wafer level ...
October 25, 2017
EMS Launches Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Engineered Material Systems, Inc. is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level ...
August 18, 2017
New Dry Film Negative Photoresist for MEMS and Wafer Level Packaging
Engineered Material Systems, Inc. is pleased to introduce the DF-3590 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer level packaging ...
January 9, 2017
EMS Debuts Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Engineered Material Systems, Inc. is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level ...
September 13, 2016
EMS Debuts Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Engineered Material Systems, Inc. is pleased to introduce the DF-3520 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging ...
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