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| Press Release - ASML |
October 20, 2016
ASML secures largest customer order in the history of its Silicon Valley software development operationsHigh-volume, multi-year purchase agreement with a major chipmaker to deliver Process Window Enhancement software suite SAN JOSE, California -- ASML Holding NV (ASML) today announced receiving the largest customer order in the history of its Silicon Valley software development operations. As part of the new high-volume, multi-year purchase agreement, a major chipmaker will leverage ASML's complete portfolio of Brion Process Window Enhancement software for its high-volume production applications to achieve higher yield at the most advanced nodes. "Over the past decade, it has become increasingly difficult for semiconductor manufacturers to continue scaling via traditional techniques due to smaller margins of error," said Yu Cao, general manager at ASML Silicon Valley. "This has driven growing market adoption of our computational lithography solutions, providing leading foundry and memory customers a competitive edge by more quickly transitioning to future nodes to extend Moore's Law." Selected for its highly accurate modeling capabilities, ASML's process window enhancement portfolio encompasses several products, including optical proximity correction (OPC), which optimizes photomask designs to enhance manufacturability of device patterns. ASML has expanded the capabilities of this software with a physical resist shrinkage model to support negative tone development (NTD). Chipmakers are using NTD -- retaining the photoresist area that is exposed by light -- to achieve higher contrast and imaging quality. However, NTD can cause vertical and lateral resist shrinkage that can significantly affect the final patterns printed on the wafer, which needs to be addressed by applying new software models. "Without the use of computational models to accurately capture critical process effects, like resist shrinkage, engineers can't ensure wafer patterning performance meets the original design intent, and chipmakers will experience pattern defects and yield loss," said Gary Zhang, vice president Process Window Enhancement at ASML Silicon Valley. "Our software enables the next-generation nodes by improving critical dimension (CD) control and enlarging the process window." The Silicon Valley group is part of ASML's Holistic Lithography offering -- one of the company's growth drivers. Since its acquisition in 2007, ASML's Silicon Valley operations have experienced double digit growth year-over-year and moved to a new building this year to support its increasing customer base and future business. ASML For more information visit: http://www.asml.com |
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