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June 15, 2016

PacTech USA celebrates 15 years in Silicon Valley: expanding services & capabilities!
Santa Clara, CA - PacTech, leading supplier of wafer level bumping and packaging services, is pleased to announce the 15th anniversary of PacTech USA in Santa Clara! Thriving for a decade and a half at a time when Silicon Valley companies come and go in the blink of an eye is a true accomplishment. President & CEO of PacTech Group, Mr. Heinrich Luedeke's remark: "PacTech USA is not only a demonstration center for the advanced packaging equipment manufactured at PacTech Germany in the Berlin region. PacTech USA is also a subcontractor that helps customers with their needs with wafer level chip scale packaging (WLCSP), 2.5D Interposers, and rigid or flex substrates!"

A wide range of wafer bumping subcontracting services is available in Santa Clara, including UBM (under bump metal) and OPM (over pad metal) plating, solder ball attach, wafer repassivation, wafer level RDL and CSP & BGA ball rework/re-balling. Services in the area of backend, inspection & die sorting/packaging include laser marking, wafer sawing, AOI (automated optical inspection), chip level manual microscope inspection and die packaging.

A special highlight of PacTech USA's extensive range of services is its double-sided interconnection on glass interposer for the prototyping sector. This technology is the fastest means of producing flip-chips -- priceless technology when time to demonstration is tight. Moreover, we take a very flexible approach, putting the needs of our customers first.

PacTech USA works closely with its German headquarters, which is going from strength-to-strength -- they are currently establishing a three-shift system to keep up with all contract orders and was recently accredited according to the ISO 14001 standard -- a feat that only a few German companies in our sector have accomplished to date! Dr. Thorsten Teutsch, President & COO of PacTech USA, added, "We continue making investments in new capabilities and expanded services, such as electroplating of copper, repassivation, and redistribution (RDL), to support our customers in the Americas."

PacTech

For more information visit:
http://www.pactech.de/

April 25, 2017
Annette Burczyk & Dr. Thorsten Teutsch assume new management duties for PacTech Group
As the Group has announced, Annette Burczyk and Dr. Thorsten Teutsch took over the executive management of the PacTech Group on April 1st, 2017. Heinrich Lüdeke, who ...
June 15, 2016
PacTech USA celebrates 15 years in Silicon Valley: expanding services & capabilities!
PacTech is pleased to announce the 15th anniversary of PacTech USA in Santa Clara! Thriving for a decade and a half at a time when Silicon Valley companies ...
September 15, 2015
PacTech is finalist at the competition 'Award for Midsized Enterprises'
Packaging Technologies GmbH have been honored as finalist in the competition "Award for Midsized Enterprises". It's one of the most important awards ...
December 10, 2014
PacTech and NAGASE opens new demonstration center in Taiwan
PacTech GmbH announced that the parent company NAGASE (Japan) and PacTech opened the next demonstration center on December 3rd, 2014. Various guests ...