We search for industry news, so you don't need to.
Press Releases

May 25, 2016

Promex Quik-Pak Division Exhibits Open-Molded Plastic Packages, Air Cavity QFNs at IMS
IC Microelectronics Packaging/Assembly Services Provider in Booth 2229 Offers OmPP Packages, Air Cavity QFNs, with Superior Wire Bondability and RoHS/REACH-Compliant Molding Compounds and Assembly Services Designed to Accelerate Time to Market

Santa Clara, CA -- Quik-Pak, a division of Promex, will showcase its Open-molded Plastic Packages(OmPP) for microwave and RF applications in Booth 2229 at the International Microwave Symposium (IMS), May 22-27 in San Francisco, California. Both air cavity QFN (Quad Flat No-Lead) Package and the Over Molded QFN Packages are available in off-the-shelf and custom configurations for prototype, mid volume and production volume requirements. Features of OmPP include:

· Gold plating for wire bondability and thermal regulation
· RoHS and REACH compliant green molding compound
· Short, highly conductive interconnects
· JEDEC outlines with matching ceramic, plastic and glass lids

Quik-Pak also offers complete assembly services to help accelerate time to market, including flip chip and wire bonding (Au, AI and Cu from 0.6-20 mil diameters) wafer thinning, dicing, and pick and place.

"While there are firms promising fast turns, few have the technical expertise, production resources and years of industry experience to provide the high level of quality that we do -- even if you need your devices in eight hours," said Quik-Pak Director of Sales and Marketing Casey Krawiec.

The International Microwave Symposium will host more than 8,500 attendees from around the world. In addition to the exhibition, this six-day event offers 75 technical sessions, workshops and panel sessions for designers, researchers, developers and academics in the microwave/RF industry.

About Quik-Pak
Quik-Pak's IC packaging solutions for complex RF/MW devices include air cavity plastic QFN packages, over-molded plastic QFN/DFN packages, custom transfer molded packaging, and custom assembly for ceramic, laminate, COF and COB. Quik-Pak also offers assembly services from prototype design validation to full production, as well as wafer preparation services including dicing, backgrinding and pick and place. The company's 15,000 square foot facility includes fully automated equipment for high throughput and maximum yield. Quik-Pak is a division of Promex Industries. More information about Quik-Pak is available at www.icproto.com, or by calling 858-674-4676.

About Promex
Promex Industries specializes in engineering and proof of concept through production of Class III implantable and other complex medical devices. The company operates a 30,000 square foot assembly facility in Silicon Valley with RoHS-optimized surface mount technology (SMT), Class 100 and 1000 clean rooms and fully controlled process flows for high reliability. Together, the Promex and Quik-Pak facilities are ISO 13485:2003 and ISO 9001:2008 certified, ITAR registered and compliant to regulatory requirements for medical products. More information is available at www.promexindustries.com or by calling 408-496-0222.

Quik-Pak Custom Air Cavity QFNs (JPEG photo available upon request from mar@c3pr.com)

Media Contacts c3PR: Mar Junge 408-219-0101 & Quik-Pak: Casey Krawiec 858-521-3607

Quik-Pak

For more information visit:
http://www.icproto.com

March 9, 2018
The Manufacturing Institute Will Honor Jeanne Beacham
The Manufacturing Institute announced they will award Jeanne Beacham with the Women in Manufacturing STEP Ahead Award. The STEP Ahead Awards honor women who have ...
February 16, 2018
VIEWPOINT 2018: Jeanne Beacham, CEO, Delphon
beachem_Jeanne_2013_60-75_1_thumb_1.gif
2017 came to a close with record breaking growth across many sectors and as we reflect back there has been so many changes across our industry and at Delphon. 2017 may have been the year of investment! Like many companies we enjoyed the growth with double digits and excited by the future we invested ...
June 21, 2017
Delphon to Showcase Custom Films for FHE at FLEX
Delphon will be showcasing its custom films for Flexible Hybrid Electronics (FHE) at the upcoming FLEX 2017 show June 19-22 in Monterey, CA. Delphon's in-house R&D ...
May 25, 2016
Promex Quik-Pak Division Exhibits Open-Molded Plastic Packages, Air Cavity QFNs at IMS
Quik-Pak will showcase its Open-molded Plastic Packages(OmPP) for microwave and RF applications in Booth 2229 at the International Microwave Symposium (IMS) ...
June 19, 2014
Quik-Pak Selected to Provide Enhanced Molding and Assembly Services
Quik-Pak has expanded its transfer molding and assembly capabilities to accommodate the increased demands of innovative companies in the wireless ...
March 4, 2014
Delphon Appoints Rajesh Varma To Chief Technology Officer
Delphon announced the appointment of Rajesh Varma to Chief Technology Officer. Mr. Varma will support all four of Delphon's divisions, including Gel-Pak ...
January 16, 2013
Jeanne Beacham, President, Delphon Industries
beachem_Jeanne_2013_60-75_1.gif
What will 2013 hold? There are so many viewpoints… Most say it will be the same as 2012 with consumer confidence improving, unemployment remaining high in the 7% range, and low interest rates! The semiconductor / high tech industry will continue to grow with numbers in the 5-10%. Some people call those low, but most industries call them a great year and so should we!! What will Delphon being doing? Taking advantage of the ...