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Press Releases

June 5, 2015

TechSearch International Makes Sense of Package Alphabet Soup
With new packages continuously being introduced, TechSearch International's latest Advanced Packaging Update focuses on making some sense out of the alphabet soup of package options for split die.

Application targets range from high-performance solutions for devices such as FPGAs to application processors found in mobile devices. SLIM, SWIFT, EMIB, NTI, and SLIT are high-density substrates without through silicon vias (TSVs). Fan-out wafer level packages (FO-WLPs) also provide an option for a split die package. Roadmaps from FO-WLP suppliers show the transition to finer features.

Package options for power devices are also discussed, including a special section on automotive packages. A detailed analysis focuses on the trends in Cu clip packages for MOSFETs. A double-digit growth rate is projected for this increasingly popular package. Also included is an update on the market for embedded component packages with a new market forecast split into actives and passives.

The detailed analysis is based on the company's 27-year history of studying markets and critical technology and infrastructure issues in advanced packaging. The 37-page report with full references provides analysis on these important developments. A set of 30 PowerPoint slides accompanies the report.

TechSearch International, Inc., founded in 1987, is a market research leader specializing in technology trends in microelectronics packaging and assembly. Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis. TechSearch International professionals have an extensive network of more than 17,000 contacts in North America, Asia, and Europe. For more information, contact TechSearch at tel: 512-372-8887 or see http//www.techsearchinc.com

TechSearch International

For more information visit:
http://www.techsearchinc.com

December 18, 2018
TechSearch International - FO-WLP Panel Production Becomes a Reality
Panel FO-WLP is in production at Powertech Technology, Inc. (PTI) for MediaTek's power management integrated circuit (PMIC) for smartphone applications. The Samsung ...
November 30, 2018
TechSearch International Explores Power Device Packaging and Assembly Trends
Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments ...
July 5, 2018
TechSearch International Analyzes Potential for 3D Sensing Modules
Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection, gesture control, automotive/industrial 3D mapping ...
June 22, 2018
TechSearch International Analyzes Trends in FO-WLP including Panel Activity
While Apple remains the main customer for TSM's Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a large area version of FO on Substrate. ...
March 6, 2018
TechSearch International Analysis Shows Packaging for Cryptocurrancy Provides a Windfall
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip chip CSPs and BGAs is expected to provide increased ...
January 3, 2018
TechSearch International Analyzes New Automotive Packaging Trends
More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for advanced driver assistance ...
November 21, 2017
TechSearch Int'l Forecasts Growth for High-Density FO-WLP and Examines Panel Potential
Growth for high-density fan-out wafer level packages continues unabated, with Apple's continued use of TSMC's InFO process in its smartphone application processors. ...
April 18, 2017
TechSearch International Analyzes High-Performance Package Trends
A variety of alternatives are challenging silicon's role in advanced packaging interposers for highperformance applications. The first applications using silicon interposers ...
January 24, 2017
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile packages ...
January 20, 2017
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile ...