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Press Releases

April 27, 2015

MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder
BILLERICA, MA -- MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has integrated in situ light measurement for Active Optical Cable (AOC) into the MRSI-M3 Ultra Precision Assembly Work Cell.

The overall process begins with the placement of the die on an AOC board. For a board which contains an optical transmitter and receiver this would normally consist of a laser diode array, photo detector array, TIA and a driver chip. The MRSI-M3 Ultra Precision Assembly Work Cell dispensers conductive epoxy, perform vision alignment and then places the devices with 3 micron or better placement accuracy.

Following thermal curing and wire bonding the MRSI-M3 dispenses UV and thermal cure epoxy, performs vision alignment and then places the lens. While holding the lens in place the system measures the light output from the pre-characterized device. This measurement process can be done post UV and thermal cure to characterize any shift due to epoxy curing.

MRSI Systems

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January 14, 2019
VIEWPOINT 2019: Michael Chalsen, President, MRSI Systems
MRSI Systems enters 2019 with two new product families MRSI-HVM3 and MRSI-H3 (complementing our traditional market-leading MRSI-705 and MRSI-M3 products for R&D/medium volume production). These two product families are targeted towards high-volume applications driven by 5G wireless, data center, telecommunication ...
November 13, 2018
MRSI Announces HVM3 die Bonding Demonstration Capability in Shenzhen China
MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district ...
September 6, 2018
MRSI Systems Announces 'One Stop Shop' Die Bonding Solutions at CIOE and ECOC
MRSI Systems (Mycronic Group) will be demonstrating our "One Stop Shop" capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen ...
September 4, 2018
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3mm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used ...
August 30, 2018
MRSI Launches new MRSI-H3TO Die Bonding Product Family
MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3mm high speed die bonder which will be the first of its kind to address the multi-die and multi-process ...
August 23, 2018
MRSI Systems launches MRSI-HVM3P for new applications extending the MRSI-HVM3 die bonder family
MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active ...
June 4, 2018
Mycronic acquires MRSI Systems, LLC
Mycronic AB (publ), acquires 100% of MRSI Systems, LLC (MRSI), headquartered in North Billerica, Massachusetts, in the USA. The purchase price amounts to USD 40.7 million ...
March 12, 2018
MRSI Systems' New Product MRSI-HVM3 Die Bonder Has Entered Volume Production
MRSI Systems is pleased to announce that our new MRSI-HVM3 system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy ...
January 30, 2018
VIEWPOINT 2018: Michael Chalsen, President, MRSI Systems
MRSI Systems enters 2018 with its strongest family of products since the company was formed in 1984. The need has never been greater for customers to optimize their performance of such metrics as process yield, throughput, and uptime. The recent launch of our MRSI-HVM3, a high speed, flexible, 3 micron die bonder ...
August 28, 2017
MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor 1st Laser Executive Forum at CIOE
MRSI Systems will be exhibiting at the 19th China International Optoelectronics Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our Chinese ...