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Press Releases

April 27, 2015

MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder
BILLERICA, MA -- MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has integrated in situ light measurement for Active Optical Cable (AOC) into the MRSI-M3 Ultra Precision Assembly Work Cell.

The overall process begins with the placement of the die on an AOC board. For a board which contains an optical transmitter and receiver this would normally consist of a laser diode array, photo detector array, TIA and a driver chip. The MRSI-M3 Ultra Precision Assembly Work Cell dispensers conductive epoxy, perform vision alignment and then places the devices with 3 micron or better placement accuracy.

Following thermal curing and wire bonding the MRSI-M3 dispenses UV and thermal cure epoxy, performs vision alignment and then places the lens. While holding the lens in place the system measures the light output from the pre-characterized device. This measurement process can be done post UV and thermal cure to characterize any shift due to epoxy curing.


MRSI Systems

For more information visit:
http://www.mrsisystems.com

March 12, 2018
MRSI Systems' New Product MRSI-HVM3 Die Bonder Has Entered Volume Production
MRSI Systems is pleased to announce that our new MRSI-HVM3 system has entered a volume production phase, using advanced Demand Flow Technology (DFT) to satisfy ...
January 30, 2018
VIEWPOINT 2018: Michael Chalsen, President, MRSI Systems
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MRSI Systems enters 2018 with its strongest family of products since the company was formed in 1984. The need has never been greater for customers to optimize their performance of such metrics as process yield, throughput, and uptime. The recent launch of our MRSI-HVM3, a high speed, flexible, 3 micron die bonder ...
August 28, 2017
MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor 1st Laser Executive Forum at CIOE
MRSI Systems will be exhibiting at the 19th China International Optoelectronics Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our Chinese ...
August 16, 2017
MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing
MRSI Systems is launching a new High Speed Die Bonder, MRSI-HVM3, to support our photonics customers' high volume manufacturing requirements. The MRSI-HVM3 is in full ...
March 22, 2017
MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy
MRSI Systems announces the installation of its flagship MRSI-M3 Die Bonder in AIM Photonics Academy's Education and Practice Factory at MIT in Cambridge, MA. This is the ...
January 11, 2017
VIEWPOINT 2017: Daniel F. Crowley, Vice President of Sales, MRSI Systems
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MRSI Systems is a leading manufacturer of fully automated, ultra-precision die bonding and epoxy dispensing systems. Our systems are able to deliver the unique combination of speed, ultra-high precision and flexibility. MRSI's systems are built on common platforms that can be configured to meet specific ...
May 31, 2016
MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet
MRSI Systems announces supply of its flagship MRSI-M3 precision die bonding assembly work cell to the Fabrinet West facility in Santa Clara, CA, US ...
April 27, 2015
MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder
MRSI Systems announced it has integrated in situ light measurement for Active Optical Cable (AOC) into the MRSI-M3 Ultra Precision Assembly Work Cell. The ...
July 1, 2013
Newport Announces Joint Development Agreement with IBM
Newport Corporation announced that they have entered into a joint development agreement with International Business Machines Corporation, to collaborate on the ...