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October 3, 2014

Heraeus to Showcase Thick Print Copper Paste at IMAPS

Industry Leader to have significant presence at the 47th Symposium on Microelectronics, displaying both products and industry knowledge  

West Conshohocken, PA -- Heraeus Precious Metals, a world leader in industrial precious and specialty metals and technology, announced today that they will be showcasing Thick Print Copper Paste for power electronics, Celcion® for LED module manufacturing and information on a new material set for high-temperature electronics at the International Microelectronics Assembly and Packaging Society's (IMAPS) 47th Symposium on Microelectronics. This year's symposium will be held Oct. 14–16, 2014 in San Diego, California.  

"Every year, we place a great deal of importance on the IMAPS symposium," said David Malanga, Vice President Business Unit Circuits & Components America. “It is a critical show for the growth of our Electronic Materials Division, and has a positive impact in helping to boost sales and strengthen our positioning within the market place. We are excited for what this year's show has to offer, and look forward to seeing what’s in store for the industry".  

Heraeus' Electronic Materials Division will have a large presence at the show. The team will present several speaking sessions, conduct a seminar and host a booth where new products will be displayed.   

Heraeus will be participating in the following sessions:  

* Professional Development Course, The Technology of Screen Printing – Co-hosted by David Malanga, Vice President Business Unit Circuits & Components America.
Date: Oct.13 from 10:00 a.m. – 6:00 p.m.

 * Advanced Packaging & Assembly: Featured Speaker Session on the Advancement in Thermosonic Bonding Wire – presented by Sarangapani Murali, Senior Principal Research Engineer, Heraeus Materials Singapore Pte Ltd.     
Date: Oct.14 from 2:30-2:55 p.m.    

* Materials & Processes: Performance Assessment of a Low Temperature Polymer Conductor for Lead-Free Soldering Processes – presented by Steven Grabey,  Research Engineer, with input from Samson Shahbazi, Senior Research Scientist; Sarah Groman, Technical Service Engineer; and Catherine Munoz Technical Service Technician   
Date: Oct. 14 from 3:00 – 3:25 p.m.  

* Future of Packaging:  Program on Printed Electronics & Additive Manufacturing – Co-chaired by Samson Shahbazi, Senior Research Scientist, Thick Film Paste at Heraeus       
Date: Oct. 16 from 1:00 – 4:00 p.m.  

The 47th Symposium on Microelectronics will cover three tiers of electronics including: Systems and Applications; Design and Related Measurements; and Materials, Process and Reliability. IMAPS 2014 will feature the following six technical tracks that span three days: Interposers & 3D Packaging; The Future of Packaging; Advanced Packaging, Interconnects & Assembly; Materials & Processes; Modeling, Design & Test; and special sessions on 3D, Embedding and Reliability. The 2014 Symposium will also highlight an Interactive Industry/Student Poster Session, a Panel Discussion the morning of Thursday, Oct. 16 on The Future of Packaging, as well as six keynotes.



Heraeus

For more information visit:
http://www.eraeus.com

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