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Press Releases

June 19, 2014

Quik-Pak Selected to Provide Enhanced Molding and Assembly Services

San Diego, CA -- Quik-Pak, a leader in integrated circuit (IC) packaging, wafer processing, and advanced assembly services, has expanded its transfer molding and assembly capabilities to accommodate the increased demands of innovative companies in the wireless electronics and solar industries.

Quik-Pak's newly expanded manufacturing space, which is dedicated to its transfer molding operation, will be utilized to meet the volume demands of its customers. The company has also expanded its wafer preparation facility to accommodate new equipment capable of supporting high-volume wafer backgrinding and dicing operations.

"This expansion comes in response to our customers' demands for a reliable, US-based, mid-volume packaging and assembly provider," said Casey Krawiec, Global Sales and Marketing Manager. "Historically, Quik-Pak has been the go-to company for quick turn and prototype builds. Our customers have increasingly asked us to provide packaging and assembly services in higher quantities. With this expansion and purchase of new equipment, we now have greater capability than ever before." "The addition of an ISO class 8 molding room and the expansion of our ISO class 7 dicing area allow us to provide volume manufacturing of saw-singulated air-cavity and over-molded QFN and DFN packages to our customers," says Steve Swendrowski, Quik-Pak General Manager.



Quik-Pak

For more information visit:
http://www.icproto.com

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