We search for industry news, so you don't need to.
May 1, 2014

Hesse Mechatronics part of President Obama's Next Generation Power Electronics Institute

President Obama declares 2014 a year of action

A consortium of 18 companies and 6 universities are partnering with the US government to strengthen US manufacturing. Hesse Mechatronics will provide valuable wedge bonding process knowledge and equipment to the consortium.

Proposed in the President's latest State of the Union address, The Next Generation Power Electronics Institute is now a reality led by North Carolina State University. The consortium is one of three initiatives by President Obama to bring together research and product development in a collaborative effort among companies, universities, training and academic institutions, and federal agencies. The consortium will serve as a "teaching factory," supporting students and workers, in addition to enabling small manufacturers to access cutting edge capabilities, manufacturing processes and equipment to design, test and produce next generation power electronics products in the USA.

Wide Bandgap Semiconductor Devices

Superior semiconductor materials will enable greater energy efficiency in industrial-scale power electronics and clean energy technologies. — U.S. Department of Energy

Wide bandgap semiconductor materials, the focus of The Next Generation Power Electronics Institute, enable smaller, faster and more reliable power electronic devices than those that are silicon-based. Harnessing the benefits of wide bandgap semiconductor technology, including reduced weight, volume and costs, can lead to significant energy savings in products such as industrial processing equipment and consumer appliances, in addition to accelerating the adoption of new technologies including electric vehicles and renewable energy.

Hesse Mechatronics has become known for supporting educational institutions in the development of emerging technologies in the field of backend semiconductor assembly, specifically wedge wire bonding. The company will provide the consortium with its industry-leading wire bonding equipment and ongoing process knowledge with respect to thin and heavy wire wedge bonding, ribbon bonding and a variety of metallization processes and materials.

Additional Information
President Obama's US manufacturing initiatives: http://www.Whitehouse.gov
Next Generation Power Electronic Manufacturing Institute: http://www.ncsu.edu/power
Wide bandgap semiconductor technology: http://www.Energy.gov
Hesse Mechatronics: http://www.hesse-mechatronics.com
To see wire bonding in action: http://www.wirebonddemo.com



Hesse Mechatronics, Inc.

For more information visit:
http://www.hesse-mechatronics.com

August 21, 2019
Hesse Mechatronics Announce Latest Hires
Hesse Mechatronics is pleased to announce our latest hires that will address our growing business in the newly emerging battery and energy storage markets. Both ...
August 9, 2018
Hesse Mechatronics Announces Two New Key Employees
Hesse Mechatronics Inc. have announced the addition of two new key employees, Mr. Rene Cruz and Mr. Vicmark Divinagracia. Rene Cruz joined Hesse Mechatronics ...
September 29, 2015
Hesse Mechatronics Wide Band Gap
Hesse Mechatronics has partnered with North Carolina State University in packaging development of Wide Band Gap power devices. Under the direction ...
April 23, 2015
Kristian Oftebro Joins Hesse Mechatronics as Senior Process Development Engineer
Hesse Mechatronics, Inc. announces that Kristian Oftebro recently joined the company as Senior Process Development Engineer. Kristian brings over fifteen ...
May 1, 2014
Hesse Mechatronics part of President Obama's Next Generation Power Electronics Institute
A consortium of 18 companies and 6 universities are partnering with the US government to strengthen US manufacturing. Hesse Mechatronics will provide ...
April 3, 2014
Tod Sladek Joins Hesse Mechatronics to Support Advanced Wire Bonding Process Development
Hesse Mechatronics, Inc. recently announced that Tod Sladek has joined the company as Applications Engineer, Advanced Process Development & Demonstration ...
March 3, 2014
Hesse Mechatronics to Demonstrate Heavy Wire and Ribbon Bonding at APEC
Hesse Mechatronics, Inc. announces three days of heavy wire and ribbon bonding demonstrations on the BondJet BJ935 Fully Automatic Heavy Wire Bonder ...
February 28, 2014
Hesse Mechatronics to Demonstrate Heavy Wire & Ribbon Bonding at APEC
Hesse Mechatronics, Inc. announces three days of heavy wire and ribbon bonding demonstrations on the BondJet BJ935 Fully Automatic Heavy Wire Bonder at ...
February 11, 2014
Jiro Hashizume Joins Hesse Mechatronics as Country Manager for Japan
Hesse GmbH announces that Jiro Hashizume recently joined the company to head up its new subsidiary, Hesse Mechatronics Japan Co., Ltd. Mr. Hashizume ...
January 27, 2014
Hesse Mechatronics Appoints Representative for South America
Hesse Mechatronics, Inc. recently announced that it has appointed HTMG as the company’s sales representative for South America. HTMG, led by Claudinei ...