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March 13, 2013

Heraeus presents new products at Semicon China 2013

New high-quality bonding wires and assembly materials as main highlights

Competence in products and services in the area of sputtering targets

At this year's Semicon China (19 21 March 2013) in Shanghai, Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets.  

New innovations in the area of Bonding Wires

In the area of bonding wires the company shows the new silver alloy wire AgUltra. The good reflectivity surface, as well as good mechanical and electrical properties make it particularly applicable for LED Device and IC Packaging. Especially, silver makes this wire a cost-effective alternative to gold wires.

The MaxSoft2 is the newest copper wire in the current product range of Heraeus Bonding Wires. Due to its better workability it can be especially used for high pin count and fine pitch applications.

Convincing Assembly Materials

With the new water soluble halogen free solder paste F590 Heraeus has another groundbreaking product in its series of solder pastes.

The sophisticated water soluble halogen free flux activation system provides excellent wetting. There is minimal void formation on a variety of substrates, component terminations and surfaces.

In its range of water cleanable fluxes Heraeus has developed the WSD3890. It is a water soluble halogen free tack flux designed for bumping, BGA and CSP applications. Some key benefits include its excellent cleaning properties and long tackiness life.

Expertise in Sputtering Targets

With its advanced products and services Heraeus will also present its competency in the area of sputtering targets. These find usage in markets such as hard disc drives, electronics/semiconductor, display, glass or photovoltaics. Due to the focus on an ongoing process of R&D, Heraeus has gained a lot of expertise and is a market-leading manufacturer and supplier of sputtering targets and thin film coating materials.

Visit our booth No. 3341 in Hall N3 at the Semicon China in Shanghai from 19 to 21 March 2013.

Heraeus

For more information visit:
http://www.heraeus-contactmaterials.com

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Heraeus presents new products at Semicon China 2013
At this year's Semicon China in Shanghai, Heraeus will present numerous product highlights with regard to bonding wires, assembly materials and sputtering targets ...