Flip chip and wafer level packaging continues to expand to a wide range
of applications and device types.
TechSearch International's new study, 2013 Flip Chip and WLP: Recent Developments and Market Forecasts,
provides unparalleled analysis of the underlying developments and trends in the
industry based on the company’s 25-year history of studying the market and
critical infrastructure issues.
Drivers for flip chip continue to
be performance and form factor. While
processors and other high-performance devices have been using flip chip in
package (FCIP) for many years, FCIP is also expanding in mobile computing,
especially smartphones and tablets. In
units, the compound annual growth rate (CAGR) from 2011 to 2016 is almost 26
percent, while in number of wafers the CAGR is only 13.5 percent because much
of the growth is for small size die. The
industry is experiencing a transition from solder bump to copper pillar, just
as it moved from an evaporated bump to a plated process. While the transition to copper pillar is
underway, SnAg remains the Pb-free solution of choice. Using current exemptions, some companies
continue to ship products with eutectic and high-Pb solder bumps. The report provides details of flip chip
applications, bump types, and pitch trends based on extensive interviews and
Increased demand for thinner,
lighter-weight portable products continues to drive wafer level package (WLP)
growth. These packages offer a small
footprint and a low-profile solution that enables ultrathin consumer products
such as smartphones and tablets. The
CAGR for WLPs in units from 2011 to 2017 is almost 13 percent for the six-year
period, while the CAGR in wafers is slightly over 14 percent. While many wire bond designs are
transitioning to WLP, some FCIP is also converting to WLP. Analog devices account for large shipment
numbers in both units and wafers, but shipments of devices with RF functions
are also contributing to strong growth. WLPs have historically been used for low-pin-count applications (≤100
I/O). However, many companies plan to
use WLPs for higher-pin-count applications with larger die sizes--up to almost 8
mm on a side. In the case of larger die
sizes, companies will have to trade off conventional fan-in technology with
0.35mm or finer ball pitch versus moving to fan-out solutions. A number of companies ship products in fan-out
WLPs (FO-WLP). Many configurations use a
panel process and can be categorized as an embedded die package (EDP) solution. The use of FO-WLPs will increase if cost,
reliability, and supply chain targets can be met, but the EDP may ultimately
see even stronger growth.
The 175-page report with full references provides forecasts for the
flip chip wafer bumping market by product application, device type, FCIP/FCOB
split, number of wafers, and number of die. Merchant and captive capacity is included and projections by bump type
and wafer size are provided. Geographic
changes in the location of bumping supply are analyzed. Forecasts for WLP demand in number of die,
wafers and device type are provided. Bumping, wafer level packaging, and contract assembly service providers
are highlighted in terms of capability and experience. Contacts for these companies as well as
suppliers of laminate substrates and bonding equipment are provided. A complimentary set of PowerPoint slides
accompanies the report.
September 23, 2013|
Silicon Interposers: Has the Market Arrived?
TechSearch International, Inc. has released its analysis of the market for silicon interposers. The report highlights the latest trends in silicon interposer ...
TechSearch International, Inc.
July 22, 2013|
3D InCites and TechSearch Announce Winners of First 3D InCites Awards
3D InCites and TechSearch International announced the winners of the first annual 3D InCites Awards Program, established to recognize achievements to further the ...
June 3, 2013|
SavanSys Solutions and TechSearch Announce Release of 2.5D and 3D Packaging Cost Trade-off Model
After successful collaboration on cost models for Flip Chip, Wire Bond, Wafer Level Packaging, and other technologies, SavanSys Solutions and TechSearch ...
May 23, 2013|
3D InCites and TechSearch International Launch Awards Program
3D InCites and TechSearch International announced the first annual 3D InCites Awards. All proceeds of the awards program will benefit the IEEE Frances B.Hugle ...
March 7, 2013|
2013 Flip Chip and WLP: Recent Developments and Market Forecasts
Flip chip and wafer level packaging continues to expand to a wide range of applications and device types. TechSearch International's new study, 2013 Flip Chip ...
November 28, 2012|
TechSearch Announces the Establishment of the IEEE Frances B. Hugle Engineering Scholarship
TechSearch International, Inc. announces that in celebration of its 25th anniversary the company partnered with IEEE Women in Engineering Committee (WIE) to ...
TechSearch International, Inc.
August 16, 2012|
Manufacturing and Business Issues Push Out Adoption of 3D TSV
TechSearch International has released its analysis of the 3D TSV market and alternatives such as Package-on-Package (PoP) and 2.5D. The new study ...
June 11, 2012|
Driven by Mobile Phones and Tablets, CSPs Show Strong Growth
TechSearch International has released its market forecast for BGAs and CSPs. The BGA market is divided into plastic, tape, and ceramic structures. The CSP ...
February 15, 2012|
Embedded Components Generate New Discussion
Embedded components--actives and passives--embedded in IC package substrates are generating renewed interest. TechSearch International's recent ...
November 18, 2011|
Fan-out Wafer Level Packages Gain Momentum
TechSearch International conducted a survey to determine the market growth for fan-out wafer level packages (FO-WLPs) and the latest developments. FO-WLPs ...
August 9, 2011|
Rising Gold Prices Drive Industry to Double Copper Wire Shipments in 2011
With the price of gold now above $1,600 per ounce, the move to copper wire is accelerating. Based on a recent survey, TechSearch International's ...
July 7, 2011|
TechSearch Analysis Reveals Obstacles to Lowering Cost of LED Packaging
There are no standard high brightness or high power LED packages. Each package is unique to the supplier and therefore it is impossible to ...
May 24, 2011|
TechSearch International Analysis Shows Double-Digit Growth for PoP
Package-on-package (PoP) volumes continue to grow with a CAGR of 31% from 2009 to 2015. Applications driving this double-digit growth include ...
December 16, 2010|
TechSearch Int'l Study Shows Strong Flip Chip and WLP Growth
The adoption of flip chip and wafer level packaging continues to expand to a wide range of devices. TechSearch International¡¯s new study, 2010 ...
July 30, 2010|
TechSearch International Analyzes Silicon Interposer Market
The current incarnation of the silicon substrate is a simplified version of the full 3D-TSV being developed by many companies. Substrates can be ...
TechSearch International, Inc.
February 2, 2010|
TechSearch Int'l Provides Market Forecast for 3D TSV Adoption
TechSearch International's new report, 3D Through Silicon Via: Infrastructure and Markets, provides a realistic forecast of the 3D ...