Berlin, Germany -- PAC
TECH introduces the new automatic Laser Soldering machine for assembly of Schottky
Diodes and Bypass Diodes.
automatic machine punches and forms lead frames, dispenses solder paste and performs
diode laser attach to the lead frame. A final electrical and visual test is
done on the assembled modules and chip packages.
its experience in laser soldering and its innovative SB² and LAPLACE platforms,
PAC TECH provides leading-edge technology for Laser Assisted Flip Chip and
Solder Balling Equipment. In addition to standard machine platforms, PAC TECH designs
and manufactures customized equipment solutions.
For additional information,
please visit http://www.pactech.de/index.php?option=com_content&view=article&id=192&Itemid=96
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