Berlin, Germany -- PAC TECH introduces the new automatic Laser Soldering machine for assembly of Schottky Diodes and Bypass Diodes.

The automatic machine punches and forms lead frames, dispenses solder paste and performs diode laser attach to the lead frame. A final electrical and visual test is done on the assembled modules and chip packages.

With its experience in laser soldering and its innovative SB² and LAPLACE platforms, PAC TECH provides leading-edge technology for Laser Assisted Flip Chip and Solder Balling Equipment. In addition to standard machine platforms, PAC TECH designs and manufactures customized equipment solutions.

For additional information, please visit http://www.pactech.de/index.php?option=com_content&view=article&id=192&Itemid=96