Rosenheim, Germany: Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, is proud to present a paper during the European 3D TSV Summit (Grenoble - Jan 22-23, 2013).

The presentation will focus on quality and test-related issues in assembly of 3D ICs. Stacking dies bears a much higher risk for failure than single die technologies. Failures may happen in the dies themselves, but additionally, can potentially occur within the interposers, the laminations and in the conections. Bad parts in the stack will corrupt good ones. The worst-case scenario adds a cost-intensive component such as the memory on a stack, which is disfunctional. The KGD concept can only partly resolve this. Advanced packaging processes not only require total reliablity of the overall supply chain, but also require advanced models to reduce the risk of unprofitbale output caused by the packaging process itself.

In traditional semiconductor production, component test (for KGD) and final test for ultimate functional QA before shipment is sufficient to ensure quality but also cost-efficiency. Advanced packing methods such as 3D go beyond this. This paper will discuss methods for a distributed test flow, which compares the cost of test with the cost of non-testing with special references to the packaging process. It will also highlight the opportunities and challenges of distributed test strategies and analyse the best models for various test distributions and the specialized equipment requirements.

The theme of the first-ever Summit is "On the Road towards TSV Manufacturing," a critical issue as device designers and manufacturers increasingly cross into the third dimension as a result of the industry's continuing pursuit of building more functionality into ever-shrinking silicon "real estate."

The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production. Business-related aspects of 3D TSV will be addressed.