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May 11, 2012

Heraeus announces a High Reliability Composite Aluminum/Copper (CucorAl) Wire
  • New aluminum cladded copper bonding wire achieves good bondability, combined with excellent electrical and thermal properties
  • No modification of chip metallization is necessary
  • Introduction of the novel CucorAl wire type will be at the SMT exhibition in Nuremberg, Germany

CucorAl bonding wire is a composite wire type with a copper core and aluminum coating. The material mix of aluminum and copper provides excellent electrical and mechanical properties.

The new bonding wire vastly improves the long-term reliability during both passive temperature cycling tests and especially active power cycling tests - in comparison to pure Al material.

Steffen Koetter, Product Manager for Wedge Bonding products from the Bonding Wire Business Unit of Heraeus states "with the potential of increasing the reliability of power modules, the novel material composition will play an import role in the future bonding wire technology, supporting the recent trend towards higher power density in Power Electronic Packages."

The good bondability of the wire is achieved by the softness of the aluminum coating. At the same time, the copper core provides excellent electrical and thermal properties.

Furthermore, the Al/Cu structure enables reliable bonding windows without changing the chip metallization. CucorAl has been designed to be used with conventional bonding equipment. The wire can be applied to both, diodes and IGBTs. The copper proportion of this thick wire is between 60 to 70 percent by volume. The new product is available in diameters from 200 m to 500 m.

Background information

Today, current front-end technologies allow higher chip temperatures with up to 175 C and higher. Moreover, this fact leads to an extended range of the operating temperature with junction temperatures up to 200degC.

In order to realize optimized packages with increased power density, conventional soldering is more and more replaced by silver sintering and diffusion soldering.

This technology transfer in combination with the high reliable Al coated Cu wire shifts the end-of-life point of failure to a completely new level and therefore contributes to the rapid market growth of power devices.

Heraeus, the precious metals and technology group headquartered in Hanau, Germany, is a global, private company with 160 years of tradition. Our fields of competence include precious metals, materials, and technologies, sensors, biomaterials, and medical products, as well as dental products, quartz glass, and specialty light sources. With product revenues of 4.1 billion and precious metal trading revenues of 17.9 billion, as well as more than 12,900 employees in over 120 subsidiaries worldwide, Heraeus holds a leading position in its global markets.

Visit us at the SMT trade fair in Hall 9, Both 9-537



Heraeus

For more information visit:
http://heraeus-materials-technology.de/en

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