We search for industry news, so you don't need to.
Thermal and Mechanical Analysis of Imaging BGA Image Sensor Package

The growing demand of smartphone, cameras and automotive pushes image sensor packaging to smaller form factor and more complex substrate design. A study is carried out on UTAC iBGA.
UTAC Group
Complete this form to download
this Technical Paper.


Your Name


Your E-mail


Your Company


Your State, or Country if outside USA



More Technical Papers
Backside Metallization for Low Cost High Thermal Package
Barrier Properties of an Electroless Deposit of Co-W-P Alloy
New Insights with Integrated Metrology
Thermal and Mechanical Analysis of Imaging BGA Image Sensor Package
Achieving High Accuracy Pattern Recognition for Die Bonding
DOE relates spring probe variables to signal integrity
Imprint of High Quality DOEs
New Development of Thermally Enhanced GaN QFN with Heat Slug Attach Bonding Technology
Unit-Level Traceability for Automotive Customers
Adopting Dual Damascene to BEOL

Full Technical Paper List