We search for industry news, so you don't need to.
SB²-WB: A new process solution for advanced wire-bonding

New Technology for Wire-Soldering is the ideal solution for reliable laser-soldered wire connections for multifunctional systems and modules. It combines standard wire feeding with the unique solder-jetting process.
PacTech-Packaging Technologies GmbH
Complete this form to download
this Technical Paper.


Your Name


Your E-mail


Your Company


Your State or Country



More Technical Papers
Vertical Laser Assisted Bonding for Advanced 3.5D Chip Packaging
Collaborative Manufacturing in Photonics Packaging
MLE™ Maskless Exposure Technology
Delivering automotive quality IC packaging technology
Die Strength Characterization
False Fine Leak Testing of Hermetic Packages
Power Packaging for Automotive Semiconductors -- Now and Future
SB²-WB: A new process solution for advanced wire-bonding
CMOS Image Sensor Packaging Technology for Automotive Applications
Sockets and Adapters

Full Technical Paper List