Technical Paper: Advanced Wafer Level PKG Solutions for Telecom Infrastructure

Technical Paper

Advanced Wafer Level PKG Solutions for Telecom Infrastructure

In this work, a highly integrated WiGig/802.11ad compliant 16+16 beam forming transceiver RFIC with advanced FOWLP (fan out wafer level packaging) technology known as eWLB (embedded wafer level BGA) is presented, which supports the need for the increased demand of data traffic.
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