We search for industry news, so you don't need to.
Multichip Integrated Copper Clip Package Technology

Copper clip enables MOSFET packages to address: lower resistance, higher power and frequency switching requirements. Advancements integrated multichip solutions like DrMOS, providing advantages of smaller foot print and lower parasitic inductance.
UTAC Group
Complete this form to download
this Technical Paper.


Your Name


Your E-mail


Your Company


Your State, or Country if outside USA



More Technical Papers
Smart Recovery after Handling Failure
Bonding Technologies of Tomorrow and Beyond
Lid Sealing versus Seam Sealing
Enhancing Punch MLF® Packaging with Edge Protection™ Technology
New Fusion Bond Solution Available
Mechanical Testing On Very Small Components
Low Latency Manufacturing for Biophotonic and Medical Packaging
GHz Bandwidth Socket
Backside Metallization for Low Cost High Thermal Package
Barrier Properties of an Electroless Deposit of Co-W-P Alloy

Full Technical Paper List