We search for industry news, so you don't need to.
Optimizing Pre-treatment for Electroless Deposition on Small Pads for UBM Formation

This article describes a process for the uniform deposition of electroless nickel on sputtered or vapor deposited aluminum pads in various crystal orientations, and, secondarily, preventing aluminum damage during pre-treatment.
Uyemura
Complete this form to download
this Technical Paper.


Your Name


Your E-mail


Your Company


Your State or Country



More Technical Papers
2.5D Package and HDFO – Advanced Heterogeneous Packaging Solutions
Case Study: Extreme Low-Void, Lead Free Soldering for Power Modules
11 Myths About SiP
Bondtesting of Memory Devices
Challenges & Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Challenges in Automotive Package Development
3 Ways to Increase Plasma Uniformity
UV-Adhesive Bonding for Stud-pull
Role of Sockets in IC Product Life Cycle
MRS Sensor Technology for Challenging Measurement & Inspection

Full Technical Paper List