We search for industry news, so you don't need to.
Gold Planar Bumps for Flip Chip Bonding with Challenging Applications

Achieving consistent, quality Au Planar bumps has been a challenge that the industry has been trying to meet for years. This case study explore these difficult specifications and how to achieve them.
Palomar Technologies
Complete this form to download
this Technical Paper.


Your Name


Your E-mail


Your Company


Your State or Country



More Technical Papers
2.5D Package and HDFO – Advanced Heterogeneous Packaging Solutions
Case Study: Extreme Low-Void, Lead Free Soldering for Power Modules
11 Myths About SiP
Bondtesting of Memory Devices
Challenges & Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Challenges in Automotive Package Development
3 Ways to Increase Plasma Uniformity
UV-Adhesive Bonding for Stud-pull
Role of Sockets in IC Product Life Cycle
MRS Sensor Technology for Challenging Measurement & Inspection

Full Technical Paper List