Semiconductor Packaging News
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March 31, 2015
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Industry News
The Multiple Lives of Moore’s Law
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A half century ago, a young engineer named Gordon E. Moore took a look at his fledgling industry and predicted big things to come in the decade ahead. In a four-page article in the trade magazine Electronics, he foresaw a future with home computers, mobile phones, and automatic control systems ...
IEEE Spectrum
UMC snatches high-end 28nm chip orders from TSMC clients
United Microelectronics (UMC) has obtained some orders for high-end 28nm chips from Taiwan Semiconductor Manufacturing Company's (TSMC) major clients including ...
Digitimes
It's an Analog World
It's an Analog World: A handful of companies have risen to the challenge of specifying and supporting programmable analog chips. Ask any engineer about ...
EE Times
Analysts Cool on Intel/Altera Combo
Wall Street's excitement over reports x86 giant Intel Corp. was in talks to acquire FPGA maker Altera has left some analysts cold. The Wall Street Journal ...
EE Times
Why MediaTek Pushes Cross-Device Sharing
MediaTek, the world's third-largest chip designer, is aiming to create a technology standard that will link and share software and hardware resources ...
EE Times
Chip Could Double Wireless Data Capacity
A new microchip could double the amount of data one can transmit and receive wirelessly by enabling simultaneous transmission and reception on the same ...
IEEE Spectrum
Shares of TSMC unit soar on OTC market debut
Shares of Xintec Inc. jumped the first day of its listing on the over-the-counter (OTC) market, as many investors hoped the presence of TSMC will boost the ...
Focus Taiwan
IoT Should Not Wait for Standards
It's too early to start setting standards for the Internet of Things, argues the head of IoT at Xchanging. More than 50 billion connected devices are anticipated ...
EE Times
UMC begins construction of 12-inch fab in Xiamen
United Semiconductor, a subsidiary of United Microelectronics Corporation (UMC) in Xiamen, has begun construction of its new 12-inch fab, which is scheduled ...
Digitimes
Architecting For Optimal Interface IP Integration
Semiconductor Engineering sat down to discuss the design and integration of complex interface IP with Ty Garibay, VP of engineering at Altera; Brian ...
Semiconductor Engineering
Challenges Mount For Patterning And Masks
Semiconductor Engineering sat down to discuss lithography and photomask trends with Uday Mitra, vice president and chief technology officer for the Etch ...
Semiconductor Engineering
Researchers Claim 44x Power Cuts
Researchers sponsored by the Semiconductor Research Corp. claim they have extended Moore's Law by finding a way to cut serial link power by as much as 80% ...
EE Times
How Will Deep Learning Change SoCs?
Deep Learning is already changing the way computers see, hear and identify objects in the real world. However, the bigger -- and perhaps more pertinent ...
EE Times
Intel, Micron unveil new 3D NAND flash memory
Intel and Micron have jointly announced the availability of their 3D NAND technology. This new 3D NAND technology, jointly developed by the companies ...
Digitimes
Press Releases Submit
Imec and sureCore collaborate on SRAM Design IP
sureCore Ltd. and imec announced that they are collaborating on low-power SRAM IP. The collaboration includes the licensing of a set of imec SRAM design ...
sureCore Ltd.
Unisem Receives Supplier Excellence Award from Allegro MicroSystems
Unisem was recently honored with the Supplier Excellence Award from its valued customer Allegro MicroSystems. Allegro is a leader in developing, manufacturing ...
Unisem
Thomas Kipfer to become new COO and Member of Meyer Burger Group Management
Meyer Burger Technology Ltd has appointed Thomas Kipfer as the new Chief Operating Officer and Member of the Executive Board as of 1st October 2015 ...
Meyer Burger
White Papers Submit
Challenges of on-board narrow-pitch connections for microwave components
A 20GHz pluggable 0.5mm pitch BGA connector simplifies test/verification
Semiconductor Grade Fluxes for Copper Pillar Flip-Chip
Achieving a 75GHz test socket
TM 1014 Update and Hermeticity Spec Change
Design and Characterization of a Two-Channel Transmitter SiP Module
EMI Shielding Goes In-Package
Calendar Submit
Apr 13, 2015 - Overview of Semiconductor Manufacturing/ Albany, NY
Apr 13, 2015 - Pre Cap Visual Inspection per Mil-Std-883 (TM 2017)
Apr 14, 2015 - Wire Bonding Certification
Apr 17, 2015 - Packaging and Testing of Implanted Medical Devices
Apr 20, 2015 - Overview of Semiconductor Manufacturing Hsinchu, Taiwan
Apr 20, 2015 - Advanced CMOS Technology 2015
Apr 21, 2015 - Advanced CMOS Technology 2015
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