Semiconductor Packaging News
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October 24, 2014
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What Year Was It?
First Barrel Ride Down Niagara Falls
First Barrel Ride Down Niagara Falls
A 63-year-old schoolteacher named Annie Edson Taylor becomes the first person to take the plunge over Niagara Falls in a barrel.

The day was October 24, but what year was it?
Cartoon of the Day
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"Due to the recent budget cuts, there is no room in our budget to implement the recent budget cuts."
Copyright © Randy Glasbergen
Top Story
2.5D Timetable Coming Into Focus
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After years of empty promises, the timetable for 2.5D [KC]is coming into better focus. Large and midsize chipmakers are behind it, real silicon is being developed, and contracts are being signed. That doesn't mean all of the pieces are in place or that market uptake is at the neck ...
Semiconductor Engineering
Industry News
3D Technology Snapshots from IMAPS 2014
This year's IMAPS International Symposium purported to have "the most interposer and 3D content under one roof." I'm not sure about that, but there was certainly ...
3D InCites
China's 5-Year Plan Revealed
The year 2016 will be the Year of the Monkey in China, as well as the first year of the country's 13th Five-Year Plan, this one spanning 2016 to 2021. The ...
EE Times
TSMC Chips In to Make LG’s Own ‘Nuclun’ Smartphone Microprocessor
Taiwan Semiconductor Manufacturing, which has boosted its profile in the chip-manufacturing industry by inking deals with Apple, has added LG Electronics to ...
The Wall Street Journal
iPad Air 2: Biggest Weakness
Early reviews of the Apple iPad Air 2 all sing a similar tune: It's thin and light, the screen is better, the cameras are great, and it delivers incredible ...
EE Times
Maxim Integrated Reports Results For The First Quarter Of Fiscal 2015
Maxim Integrated Products, Inc. reported net revenue of $580 million for its first quarter of fiscal 2015 ended September 27, 2014, a 10% decrease from ...
CNN Money
Microsoft Eyes Expanding FPGA Role
Microsoft is exploring the possibility of putting an FPGA on every server in its datacenters. It's only a rough concept right now, but it could ease a very ...
EE Times
UMC's China expansion to have small impact
Although a recent investment in a 12-inch Xiamen fab has bought United Microelectronics Corp. a ticket into China's semiconductor market, analysts ...
The China Post
Apple ponders sapphire options, leaves door open for GT
Apple Inc said it is studying options for sapphire supply and might work again with GT Advanced Technologies Inc if the distressed supplier can reduce ...
Reuters
SK Hynix third-quarter profit at record high on firm chip demand
SK Hynix Inc reported record quarterly profit for the July-September period as the launch of new smartphones and steady demand from the personal computer ...
Reuters
Lam Research beats 1Q profit expectations
Lam Research Corp. reported fiscal first-quarter earnings of $141.1 million. The Fremont, California-based company said it had profit of 80 cents per share. Earnings ...
AP
What's the Fallout as IBM Goes Fabless?
IBM's pending sale of its global commercial semiconductor technology business to Globalfoundries for $1.5 billion didn't come as a surprise to industry watchers ...
PC Magazine
Intel, IBM Dueling 14nm FinFETS
Every digital semiconductor manufacturer and foundry in the world is trying to build 3D FinFETS that rival Intel, which is so far leading the pack by several ...
EE Times
Press Releases Submit
Henkel PTC Inks Lend New Efficiency, Functionality to Heating Applications
The Electronics Group of Henkel announced the development and commercial availability of LOCTITE ECI 8000 series printable inks, a line of positive temperature coefficient (PTC) ...
Henkel Electronics Materials, LLC
Ultrasonic Systems Launches New Medical Device Coating Systems
Ultrasonic Systems, Inc. announces the release of the third generation of its Prism product line configured with new options for the application of coatings ...
Ultrasonic Systems
White Papers Submit
Precise High-throughput Solder Dispensing
High Capability Die Attach Film for Small Die Applications
Challenges in Supply of Ultralow Alpha Emitting Solder Materials
Enhancing System Functionality & Performance with the Right Packaging Solutions
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly
2.5D/3D Packaging Drives New Lithography Requirements for Production Equipment
How Ultrasonics Finds the Smallest Bonded Wafer & Device Defects
Calendar Submit
Oct 22, 2014 - Conformal Coating & Precise Fluid Dispensing Process Technologies Workshop
Oct 23, 2014 - Technical Study: Concentration Monitoring & Control Techniques
Oct 28, 2014 - Intro to IC Design & Fabrication
Oct 28, 2014 - 'Wearable Electronics' - iMAPS New England Chapter Technical Meeting
Nov 3, 2014 - Understanding Semiconductor Technology & Business
Nov 12, 2014 - Understanding Semiconductor Technology & Business
Nov 13, 2014 - Overview of Semiconductor Manufacturing Austin, TX
Today's Sponsor
Quote of the Day
"Making the simple complicated is commonplace; making the complicated simple, awesomely simple, that's creativity."
Charles Mingus
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