Semiconductor Packaging News
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September 18, 2014
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Cartoon of the Day
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"If you're calling from a rotary phone, leave your name and number and I'll have my grandmother call you back to chat about the good old days."
Copyright © Randy Glasbergen
Top Story
Industry News
Taiwan IC Packaging, Testing Continue Growth
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The output value of Taiwan's integrated circuit packaging and testing sector is expected to rise 6 percent in 2015 on expectations that the global popularity of mobile devices will continue to grow. The Market Intelligence & Consulting Institute (MIC) ...
Focus Taiwan News
3D IC Notes from SEMICON Taiwan 2014
I attended the 3D IC Technology Forum at SEMICON Taiwan 2014, where many of the discussions focused on the latest memory announcements in 3D ICs from ...
3D InCites
Global semiconductor market expects over 3% on-year growth in 2015
Global semiconductor market value is estimated to reach approximately US$336.3 billion units in 2015, up 3.1% in comparison to 2014, delighted ...
Digitimes
Asia-Pacific IC Usage Domination Growing
Asia-Pacific is the dominant market for ICs for most products categories. The exceptions being Europe, leading in the automotive sector, and the ...
EE Times
Changing The IP Supplier Paradigm
Semiconductor Engineering sat down with Rich Wawrzyniak, senior market analyst for ASIC and SoC at Semico Research; John Koeter, vice president of marketing ...
Semiconductor Engineering
ASML on EUV: Available at 10nm
Extreme-ultraviolet lithography systems will be available to pattern critical layers of semiconductors at the 10-nanometer process node, and EUV will ...
Semiconductor Manufacturing & Design
Gartner Says Worldwide Smartwatch and Wristband Market Is Poised for Take Off
As smartphone vendors and component suppliers continue to expand into the wearables market, Gartner, Inc. predicts that by 2016 smartwatches will ...
Gartner
Micron SSD Allows MLC to Mimic SLC
Micron is looking to reduce power and improve performance with a new client SSD that leverages its new 128nm process technology and with a feature that ...
EE Times
TSMC sees follow-up IC orders for iPhone 6 devices
Foreign chipset suppliers have placed follow-up orders for chips to be used in iPhone 6 devices with Taiwan Semiconductor Manufacturing Company (TSMC), ...
Digitimes
iPhone 6 Future Revealed
Apple's new iPhone-6 and -6 Plus were pretty much as predicted by Jorden Edelson in iPhone 6 Facts -- Finally, Apple app developer spills the beans. As ...
EE Times
Belgium spin-off takes photonic IC design to the mainstream
Imec's investment arm Fidimec and the Flemish spin-off investment fund SOFI I are investing EUR 340k in Founded last June, Luceda Photonics will use this ...
EE Times Europe
For electronics beyond silicon, a new contender emerges
Silicon has few serious competitors as the material of choice in the electronics industry. Yet transistors, the switchable valves that control the flow of ...
Nanowerk
Semiconductor output to grow by 6% a year
The output of the global semiconductor industry is estimated to expand by 3.1% next year to US$336.3 billion from this year, driven by Apple Watch ...
Taipei Times
Press Releases Submit
Henkel Unveils First Hybrid Adhesive
Henkel has introduced Loctite 4090, an innovative hybrid adhesive that combines the key features of structural and instant adhesives ...
Henkel Electronics Materials, LLC
tra-accurate ams sensor interface integrated into battery management systems in leading Electric Vehicles
ams announced that the BMW Group is using the AS8510, an integrated automotive sensor interface, to provide extremely accurate battery voltage ...
ams AG
Bentek Announces General Availability of Its NEC 2014 Rapid Shutdown PowerRack Family of Products
Bentek announces general availability of the Bentek NEC 2014 Rapid Shutdown commercial three-phase inverter PowerRacks, PowerSkids and PowerShields ...
Bentek
Element Six Selected by European Consortium to Develop Ultrafast Pulse Disk Lasers
Element Six announced it has been selected by the European Commission's Seventh Framework Programme for Research and Technological ...
Element Six
White Papers Submit
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly
2.5D/3D Packaging Drives New Lithography Requirements for Production Equipment
How Ultrasonics Finds the Smallest Bonded Wafer & Device Defects
Core PDN Analysis of Core & Coreless Substrates
Dispenser Provides Volumetric Scan and Process Feedback
Vertical Level Socket Testing
Designing in Thermal Control for Power Modules
Calendar Submit
Sep 18, 2014 - Failure and Yield Analysis Short Course (San Jose)
Sep 18, 2014 - Medical Electronics Symposium
Sep 18, 2014 - Cleaning Before Conformal Coating
Oct 14, 2014 - 'Human Error Prevention' Seminar
Oct 23, 2014 - Technical Study: Concentration Monitoring & Control Techniques
Oct 28, 2014 - Intro to IC Design & Fabrication
Nov 3, 2014 - Understanding Semiconductor Technology & Business
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Quote of the Day
"To succeed as a team is to hold all of the members accountable for their expertise."
Mitchell Caplan
Test Your Knowledge
What's the name of the point at which condensation begins?
Answer: The dew point
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