Semiconductor Packaging News
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April 23, 2014
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According to tradition, the great English dramatist and poet William Shakespeare is born in Stratford-on-Avon.

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Cartoon of the Day
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Top Story
Ultracapacitors Built With Graphene & Carbon Nanotubes
By combining the powers of two single-atom-thick carbon structures, researchers at the George Washington University's Micro-propulsion and Nanotechnology Laboratory have created a new ultracapacitor that is both high performance and low cost. The device capitalizes ...
Semiconductor Manufacturing & Design
Industry News
DRAM chip supply to fall short of demand in 3Q14
Memory device suppliers Kingston Technology and Nanya Technology both expect the supply of DRAM chips to fall short of demand in the third quarter of 2014 ...
2013 ITRS Roadmap Calls for 3D Power Scaling; Monolithic 3D Gains Traction
At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS), which has traditionally ...
3D InCites
New Technology Symposium at SEMICON West to Spotlight Critical Issues in Semiconductor Manufacturing
SEMI has announced the new Semiconductor Technology Symposium (STS), to be held as part of the SEMICON West 2014 technical and business program agenda. The new ...
Scale-Out Storage Has Limits
Scale-out storage systems promise to be able to scale as an organization's data storage and capacity demands increase. The problem is that datacenters do not ...
EE Times
Magnetic RAM set for 50% CAGR
Magnetic RAM (MRAM) non-volatile memory components in field-induced and spin-torque transition (STT) forms are forecast to enjoy a boom over the ...
EE Times Europe
Chip equipment book-to-bill rises States-side
The book-to-bill ratio for North American manufacturers of chip equipment is in positive territory and rising with a 1.06 figure for March following ...
EE Times Europe
TSMC's 20nm follies could be making a market for Intel
Out of the roughly 25 major companies in the semiconductor fabrication business, Intel is one of biggest single owners of foundries. Except Intel isn't in the ...
STATS ChipPAC Reports First Quarter 2014 Results
STATS ChipPAC Ltd. announced results for the first quarter 2014. Tan Lay Koon, President and Chief Executive Officer of STATS ChipPAC, said, "Revenue for ...
Market Watch
Nike FuelBand layoffs: a pivot in wearables?
Nike is denying rumors that it has laid off most of the engineering team responsible for its Nike+ FuelBand SE fitness band to focus on software ...
EE Times Europe
UMC hesitates to join Samsung-Globalfoundries 14nm process alliance
United Microelectronics Corporation (UMC) reportedly is reluctant to join the Samsung Electronics-Globalfoundries alliance for the development of a 14nm FinFET ...
Li-Fi reaches 1Gbps: lighting the path to a new internet model
Harald Haas and his team are claiming another breakthrough in Li-Fi technology by demonstrating that up to 1.1 Gbps can be transmitted using light waves ...
EE Times Europe
Triangle of collaboration for finFET success
The semiconductor industry is moving towards 3-D FinFETs more for performance rather than cost. There is going to be significant drop in leakage current ...
EE Herald
Wearables, Drones Scare Americans
Most Americans think technology will improve society, but they are concerned about specific avenues of research. A survey conducted by the nonprofit Pew ...
EE Times
Graphene You Can Whip Up In A Blender
The first graphene was made by pulling layers off of graphite using Scotch tape. Now, in keeping with the low-tech origins of the material, a team at Trinity ...
IEEE Spectrum
Press Releases Submit
STS Semiconductor and Invensas to Partner on BVA Mobile Solutions
Tessera Technologies, Inc. announced that Invensas Corporation, its wholly owned subsidiary, and Seoul, South Korea-based STS Semiconductor ...
Master Bond Introduces UV15-42C
Specially formulated to optimize bond strength, Master Bond UV15-42C is a UV curable system for bonding, sealing and coating applications. This smooth paste can be ...
Master Bond
New ams current-sensing solution for battery
ams AG has introduced a reference design board which measures current to an accuracy of 1% by monitoring the voltage drop across a copper track on a PCB ...
ams AG
White Papers Submit
A novel high thermal conductive underfill for flip chip appliation
POSSUM Die Design as a Low Cost 3D Packaging Alternative
Flip Chip Assemblies with Underfill Encapsulants
Multipurpose Wire Bonding - Bumps, Wires, Combination Interconnects
Die Attach Voiding Requirements in Eutectically Bonded GaAs and GaN MMIC Power Amplifiers
Sealing Dispensing fro MEMS Wafer Capping
Cost-Effective, Conductive Die Attach Film for Laminate Packages
Calendar Submit
Apr 24, 2014 - Designing and Executing a DOE for a High-Reliability Cleaning Process
Apr 29, 2014 - Overview of Semiconductor Manufacturing Seminar/Munich
May 5, 2014 - Failure and Yield Analysis Short Course (San Jose)
May 5, 2014 - Overview of Semiconductor Manufacturing Seminar/ Tel Aviv
May 6, 2014 - 16th Meeting of Symposium on Polymers
May 7, 2014 - Microwave Packaging Technology
May 12, 2014 - Semiconductor Reliability Short Course (San Jose)
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He Still Pushes All My Buttons
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