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  Bringing the Best Together
Ablestik and Emerson & Cuming join Henkel
Bringing Best TogetherHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson & Cuming will deliver results for your production requirements. Learn more …
Henkel Corporation
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March 12, 2010

Daily Circulation Over 35,000


Semicon West:
Infinite Possibilities
Semicon EuropaImportant decisions on the future of microelectronics will be made at SEMICON West this July. Don't watch from the sidelines—get in the action. Plan now to be at SEMICON West 2009! Learn more…
SEMI

Test Your Knowledge
Who was the first person to accurately calculate the circumference ot the earth? Archimedes, Galileo, or Eratosthenes.
Answer bottom right column.


Asymtek's new DispenseJet® DJ-100
combines high speed accuracy & process control
Dispensejet DJ-100 The DJ-100 is ideal for dispensing fluids at speeds up to 150 dots per second as small as 0.002 µl (2 nl). Users will benefit from Asymtek's 15 years of jetting expertise that improve fluid control, offer better repeatability, learn more…
Nordson ASYMTEK

Letters Submit
No letters for today.

On This Day
March 12, 1923 - Dr. Lee De Forest, known as the father of radio and the grandfather of television, demonstrated a movie with sound for an audience of reporters.


New Fully-Automatic Wire Bonders
Where Productivity Meets Affordability
Soldering Made SampleHigh-performance, fine pitch wire bonders for gold ball bonding, wedge bonding, ball bumping and other capabilities designed to meet the challenges of small lot sizes, multiple product variations and frequent set-up changes. Learn more…
Questar Products International

Cartoon of the Day
image
"If you wander around the office too long, the GPS device will guide you back to your desk."
Copyright © Randy Glasbergen
Top Story  
Cracks in the Chip Sector's Momentum?
A J.P. Morgan analyst warned of what he considers the first warning signs that supply may be starting outstrip demand in the chip sector. Shares of ...
Market Watch

DI-Water vs. Chemistry:
Cleaning Under pH-Neutral Conditions
Soldering Made SampleAre you cleaning with DI-water? If so, you may be facing reliability issues. Recent studies have shown that DI-water has reached its cleaning limitations with low standoff devices. Learn more…
ZESTRON
Industry News  
Expect prices for power management ICs to stabilize
Electronics buyers have been seeing prices for power management integrated circuits increasing in the first quarter, but they are ...
Purchasing
Future of wireless sensor networks focus
A panel of experts has been set up to discuss the future of wireless sensor networks at the Embedded Systems Conference, which will be held ...
CyberMedia India Online
IC reverse engineering—a design team perspective
It has been quite a bit of fun writing these IC Insider columns over the last year. Concurrently, one of us, Randy Torrance, has been invited ...
EDN
Computer Storage Market Returns to Growth in 2010
After suffering a decline 2009, global revenue from shipments of Hard Disk Drives (HDDs) and Optical Disk Drives (ODDs) used in computers is ...
iSuppli Corporation
MEMS and sensors combined will achieve $15.2 billion in global sales by 2015
The Infoshop by Global Information would like to present a new market research report, "2010 Sensors and MEMS" by Databeans, Inc. Research ...
MMD Newswire
AMD starts banging the developer relations drum
AMD is finally doing what we have all been waiting for, promoting its developer relations program to the masses. With that in mind, it ...
SemiAccurate
LED Revolution and the Semiconductors Leading It
Energy saving LEDs technology is revolutionizing the world and some companies have seen their shares quadruple in price in 2009. The growing ...
CNBC
Electronics exports rise 51% in January
Electronics exports, the country's biggest dollar earner, grew 51.19% in the first month of the year over the first month of 2009 as the global ...
Manila Bulletin
Intel debuts six-core gaming chip
Intel has officially introduced its six-core monster for high-end gaming boxes--its first desktop chip packing that many processing cores. As ...
CNET News
Tech stocks take tentative steps forward
Technology stocks showed signs of live in late trading as the sector tried to turn back earlier losses fueled by rising prices in China ...
Market Watch
AMD working on actual netbook chipset, not due until next year
AMD is finally looking to get into the netbook game for real. Forget about the thin-and-light NEO chipset that’s been out for a while—we’re ...
CrunchGear
GlobalFoundries' Dresden fab to run 22-nm CMOS
Fab 1 is starting work to help develop 22-nm CMOS process and will run the process in volume. It is not clear whether the 22-nm will include a ...
EE Times
Applied continues to expand in Asia
Continuing to embark upon its expansion program in Asia, fab tool giant Applied Materials Inc. has opened its expanded Tainan Manufacturing ...
EE Times

PacTech's Ultra-SB2
Volume Solder Ball Placement
PacTech's SB2Volume solder ball placement solutions for 6- to 12-inch wafers and substrates with solder ball sizes down to 60µm for flip-chip applications and 200µm and higher for WLCSP. Learn more …
PacTech
Technology News  
Front-End Atmospheric Wafer Automation Products Receive Higher Market Attraction
Crossing Automation, Inc., announced strong growth in orders for its range of front-end atmospheric wafer automation products, spurred mainly ...
A to Z of Nanotechnology
Organic-silicon hybrid aims at optics
Electro-optic-polymer-filled silicon waveguides could propagate optical signals on CMOS chips at up to 100 GHz, according to GigOptix-Helix AG ...
EE Times
Samsung to produce DDR3 DRAM using 30nm-class technology
Samsung electronics has developed the industry's first 30-nanometer-class DDR3 DRAM and will mass produce the chip in second half of this year. ...
Purchasing
Super Micro comes out with a 12-Core ready Motherboard
Super Micro was one of rare companies that introduced products based on AMD's SR5650/SP5100 chipset while utilizing old processor Socket 1207 ...
Bright Side of News

Best Reflectivity Control
with ShinEtsu GBARC
GBARCShinEtsu GBARC for high NA immersion lithography. Single layer reflectivity control for CD swing control and standing wave elimination. Straighter profiles with no footing; low LER. Eliminates dual barc coats saving process steps and chemicals. Learn more…
ShinEtsu
Corporate News Submit
Applied Materials Expands Display, Solar Equipment Mfg Capability
Applied Materials, Inc. announced the opening of its newly expanded Tainan Manufacturing Center in Tainan, Taiwan. The nearly 15,000 square ...
Applied Materials, Inc.
Integra Tech Becomes a DMEA Trusted Supplier for Test Services
Integra Technologies, LLC. has been accredited by The Defense Microelectronics Activity (DMEA) as a DoD Category 1A Trusted Integrated ...
Integra Technologies, LLC.
ZESTRON Sets 2010 Goals, Raises bar from 2009 Record Results
Earlier this year, ZESTRON’s 2010 goals were announced by its worldwide President, Harald Wack, Ph.D, during an exciting company sponsored ...
ZESTRON

White Papers Submit
Feb 25, 2010    Equipment for UV processes combined with thin wafer handling
Feb 22, 2010    300 mm Lithography & Bonding Technologies for TSV
Feb 17, 2010    Detection of Faint Defects in CMOS Arrays
Feb 16, 2010    Achieving Thermal Control for Power Devices
Feb 12, 2010    All-surface Inspection for 3D interconnects & TSV Manufacturing
Feb 3, 2010    Optimal Correlation Using Probe Card Test & Analysis System

Today's Sponsor


Dynaloy Solutions for WLP
Advanced Packaging Applications
Dynaloy Solutions for WLPDynaloy offers Dynastrip™ DL88 for improved safety and better cleaning in Wafer Level CSP applications. See Dynaloy's advanced solutions for Flip Chip Bumping, Cu Pillar, Micro Pillar, Fan-out, WLCSP, and other challenging packaging cleaning processes. Learn more…
Dynaloy LLC


F&K Delvotec introduces
Automated Pull and Shear Tester
Bonding & TestingF&K Delvotec's Desk Top Micro-Factory has been enhanced. Using a New Camera system on the Pull/Shear test head we introduce Model 5600C. A fully automatic pull & shear test machine w/ pattern recognition. You can convert to an auto wire-bonder in 3 minutes? Learn more…
F&K Delvotec

Quote of the Day
"Grantarctica /n./ The cold, isolated place where scientists without funding dwell."


Graphite Conductive Epoxy
Provides Non-metallic EMI/RFI Shielding
Graphite Conductive EpoxyEP75-1 is a two part, graphite filled epoxy for use in specialty EMI/RFI shielding applications. Non-metallic filler is useful in applications where the magnetic properties are undesirable. Learn more…
Master Bond

Test Your Knowledge
Who was the first person to accurately calculate the circumference ot the earth? Archimedes, Galileo, or Eratosthenes.
Answer: Eratosthenes in approx. 230 BC

The latest news... at your fingertips
How can you and your colleagues stay on top? Only if you posess the latest information. Learn how Semiconductor Packaging News can help.
Semiconductor Packaging News

Calendar Submit
Mar 22, 2010 - SolarBangkok 2010
Mar 29, 2010 - ABCs of Basic Electronics & Devices
Mar 29, 2010 - Failure and Yield Analysis
Mar 30, 2010 - Understanding Semiconductor Technology and Business
Apr 6, 2010 - APEX EXPO 2010

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