Semiconductor Packaging News
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November 26, 2014
Circulation Over 35,000
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What Year Was It?
FDR Establishes Modern Thanksgiving Holiday
FDR Establishes Modern Thanksgiving Holiday
President Franklin D. Roosevelt signs a bill officially establishing the fourth Thursday in November as Thanksgiving Day in the US.

The day was Nov 26. What year was it?
Cartoon of the Day
"And when you're done thinking outside of the box, remember to put the box in the proper recycling bin!"
Copyright © Randy Glasbergen
Top Story
3D By Design
As an integral part of the established integrated circuit (IC) supply chain, Outsourced Assembly and Test (OSAT) companies offer IC packaging services on the open market, independent of the chip manufacturer or foundry. OSATs are a subset of the total worldwide IC packaging market ...
3D InCites
Industry News
TSMC to grab 40-50% of A9 chip orders
Taiwan Semiconductor Manufacturing Company (TSMC) is expected to secure a combined 40-50% of Apple's A9 processor orders for next-generation iPad and iPhone ...
Worldwide Tablet Growth Expected to Slow to 7.2% in 2014 Along With First Year of iPad Decline
The worldwide tablet market is expected to see a massive deceleration in 2014 with year-over-year growth slowing to 7.2%, down from 52.5% in 2013, according ...
ARM seeing troubles penetrating into PC, server industries; IoT becomes new battlefield for Intel, ARM
Despite aggressively attempting to advance into the PC and server industries, ARM-based CPU platforms will not be able to achieve any significant results ...
Your Part in the Recovery
Engineers and innovators are central to the slow but ongoing economic recovery, a top economist told a recent gathering of semiconductor executives. As bad ...
EE Times
Virtual Prototyping Takes Off
Semiconductor Engineering sat down to discuss virtual prototyping with Barry Spotts, senior core competency FAE for fabric and tools at ARM; Vasan Karighattam ...
Semiconductor Engineering
Intel Sees Path to Extend Moore's Law to 7nm
While giving very little detail about its future production plans, Intel used its investor meeting last week to re-emphasize how importantly it views Moore's ...
PC Magazine
ASML lands EUV tool orders from TSMC
Lithography system vendor ASML announced that Taiwan Semiconductor Manufacturing Company (TSMC) has ordered two NXE:3350B EUV systems for delivery in 2015 with ...
Manufacturing Bits: Nov. 25
Purdue University has devised a new technique that uses a pulsing laser to create synthetic nanodiamond films and patterns on a graphite substrate. The ability ...
Semiconductor Engineering
Applied Materials Introduces New Hardmask Process, Saphira
A new hardmask material and process was introduced this month by Applied Materials. Designed for advanced logic and memories, including DRAM and vertical ...
Semiconductor Manufacturing & Design
What Is Design-to-Cost & Why Does It Matter?
Design-to-Cost should be part of your design process. With a committed team and the right tools, you can reduce product costs and improve your competitive ...
EE Times
AMD tablet chip development stalls as priorities shift
Advanced Micro Devices' interest in tablets has waned as the company restructures operations in an effort to turn around its finances. The tablet market is in ...
PC World
ASML sees sales at 10 bln euros in 2020 if Moore's Law slows
ASML, the world's second largest maker of semiconductor production equipment, said it could nearly double annual sales to 10 billion euros by 2018 -- or up to ...
NXP acquires Quintic's Wearable and BTLE IC business
NXP Semiconductors N.V. has entered into a definitive agreement with Quintic to acquire assets and IP related to the company's Wearable and Bluetooth Low ...
EE Times Europe
Press Releases Submit
Internet of things: it is all a question of heterogeneous integration
"The most important added-value of Internet of Things (IoT) solutions will come from process of generated data", explains Yole in its latest report ...
Yole Développement
Nikon Metrology and McCrone Microscopes announce Partnership in Midwest
Nikon Metrology, Inc. and McCrone Microscopes & Accessories have announced an agreement offering Nikon Metrology's innovative products coupled with McCrone's ...
Nikon Metrology, Inc.
Nordson Advanced Technology K.K. Japan Moves to Larger Facility
Nordson Corporation announces that Nordson Advanced Technology K.K. Japan has relocated to new, larger facilities in Tokyo to deliver superior sales, service, technical ...
Nordson Advanced Technology Group
Plessey Teams with Litecool for better thermal control of LEDs
Plessey announced that it will be presenting the results of its partnership with Litecool, a Sheffield-based innovative thermal solutions provider, to ...
White Papers Submit
SMQ75--A No-Clean Die-Attach Solder Paste for Clip-Bonding
Precise High-throughput Solder Dispensing
High Capability Die Attach Film for Small Die Applications
Challenges in Supply of Ultralow Alpha Emitting Solder Materials
Enhancing System Functionality & Performance with the Right Packaging Solutions
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly
2.5D/3D Packaging Drives New Lithography Requirements for Production Equipment
Calendar Submit
Dec 4, 2014 - 'Root Cause Analysis' Seminar
Jan 19, 2015 - Overview of Semiconductor Manufacturing
Jan 19, 2015 - Overview of Semiconductor Manufacturing/ Hsinchu, Taiwan
Jan 22, 2015 - Overview of Semiconductor Manufacturing/ Singapore
Feb 4, 2015 - Understanding Semiconductor Technology & Business
Feb 5, 2015 - Overview of Semiconductor Manufacturing/ San Jose, CA
Feb 5, 2015 - Overview of Semiconductor Manufacturing Austin, TX
Today's Sponsor
Quote of the Day
"It's not enough that we do our best; sometimes we have to do what's required."
Sir Winston Churchill
Test Your Knowledge
What's considered the luckiest number worldwide?
Answer: Nine
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