Semiconductor Packaging News
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May 22, 2013
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Great Emigration Departs for Oregon
Great Emigration Departs for Oregon
A massive wagon train, made up of 1,000 settlers and 1,000 head of cattle, sets off down the Oregon Trail from Independence, Missouri.

The day was May 22, but what year was it?
Cartoon of the Day
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"No fingerprints, no picture ID, no Social Security number. I'm afraid your baby presents a serious security risk."
Copyright © Randy Glasbergen
Top Story
Intel CEO Shakes Up Units, Creates 'New Devices' Group
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Intel Corp's new chief executive, Brian Krzanich, has launched a sweeping company reorganization and created a unit aimed at growing its market share in mobile technology. The shakeup, announced internally just days after the 30-year veteran took the helm, places most ...
Reuters
Industry News
Inside Leti's Litho Lab
Semiconductor Manufacturing & Design sat down to discuss future lithography challenges with Serge Tedesco, lithography program manager at CEA-Leti; Laurent Pain ...
Semiconductor Manufacturing & Design
Timing signoff tool boosts performance, accuracy for faster closure
Cadence Design Systems has announced its Tempus Timing Signoff Solution designed to speed timing closure for complex SoCs. The new tool combines support for ...
EDN
GLOBALFOUNDRIES Joins Qualcomm, IMEC, In MRAM
Globalfoundries today joined a collaborative research program run by European research institute IMEC on STT-MRAM technology. The first IC manufacturer to ...
CDR Info
ST to deny rivals FDSOI access
STMicroelectronics is considering plans to offer its fully depleted silicon on insulator (FDSOI) process to second-tier foundries United Microelectronics Corp. ...
EE Times
imec brings Globalfoundries into its research community
imec and Globalfoundries are increasing their joint development efforts to advance spin transfer torque magnetoresistive ram (stt-mram) technology. According ...
New Electronics
ASE purchasing Toshiba’s Wuxi fab
Advanced Semiconductor Engineering Inc has acquired a semiconductor assembly and testing factory from Toshiba, taking advantage of the recent weakness in ...
Taipei Times
Qualcomm, Samsung pass AMD in microprocessor sales
Qualcomm Inc. and Samsung Electronics Co. Ltd. each passed Advanced Micro Devices Inc. in microprocessor sales in 2012, thanks to a slowdown in PC sales ...
EE Times
IC packaging sector pursues advanced technologies
China's IC packaging and testing companies are speeding up the development of advanced techniques to meet the requirements of terminal products for greater ...
Global Sources
Taiwanese researchers take aim at environmental issues
Taiwan's bulwark research centers are aiming to move the island nation up the supply chain from manufacturing to innovation by fostering cooperative industry/ ...
FreeNewsPos
Try to identify this item
This is not analog, but I thought it might be interesting and fun to guess what the item is in the photo in this link. It was 1956! The answer will be provided ...
EDN
Fabless semiconductor companies outpace IDMs for long time
IC Insights have reported from its latest study the fabless semiconductor companies have outpaced Integrated Device Manufacturers (IDM) in revenue growth in ...
EE Herald
Samsung 45-nm embedded flash coming in 2014
Samsung Electronics Co. Ltd. has announced that is has an embedded flash memory capability ready for a 45-nm logic manufacturing process. The company said that ...
EE Times
Could Intel enable $200 Ultrabook?
With the traditional PC apparently heading the way of the abacus, market research firm IHS is proposing a radical course of action: that Intel Corp. cut the price ...
EE Times
Press Releases Submit
8 GHz Epoxy Mount Socket for DDR3 Memory Packages
Ironwood Electronics has recently introduced a new high performance BGA socket for 0.8mm pitch BGA 78 pin DDR3 packages. The SG-BGA-6374 socket is designed for ...
Ironwood Electronics
A Top 5 semi vendor has qualified ALSI’s multi-beam laser dicing system
One of the largest IC and discrete device manufacturers and technology leaders, has qualified and purchased ALSI's multi-beam laser dicing system for their main ...
Advanced Laser Dicing International (ALSI)
DEK Solar Launches Breakthrough Technology for the PV Industry
DEK Solar was delighted to launch the breakthrough Fine Line Stencil(TM) at this year's Shanghai New International Expo Centre (SNEC) Photovoltaic Power Expo ...
DEK Solar
White Papers Submit
Mixed Attachment Technology Studies in RF & Optoelectronic Packages
Silicone Electrically Conductive Adhesives Go Extreme
Authenticating Electronic Components
Innovative 3D Structures Utilizing Wafer Level Fan-Out (WLFO) Technology
InPb Solder Alloys for Reliable Gold Interconnects
Non-Hermetic Packaging For Military And Aerospace
The Value of InPb Solders
Calendar Submit
May 27, 2013 - IC Packaging Design and Modeling
May 28, 2013 - ECTC
Jun 3, 2013 - Failure Analysis Short Course (San Jose)
Jun 11, 2013 - MEMS Sensors -Microcantilever-based Sensing Platform and Energy Conversion
Jun 13, 2013 - Limitations of Cleaning with DI-water Only
Jun 26, 2013 - Semiconductor Reliability
Jun 26, 2013 - Semiconductor Reliability Short Course (Malaysia)
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Quote of the Day
"Do not trust your memory; it is a net full of holes; the most beautiful prizes slip through it."
Georges Duhamel
Test Your Knowledge
Which sea has no land borders?
Answer: The Sargasso Sea
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