We search for industry news, so you don't need to. 		  Micro Dispensing Technology
Technical white paper
imageThe trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. These requirements often call for tiny dot sizes of paste, epoxy & conductive adhesives. Learn more from this paper…
DL Technology
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Ideal Lab / R&D Bonder
Ultimate application flexibility in one platform
R&D Bonder videoHighest placement accuracy and repeatability for flip chip, MEMs, Sensors, Opto, RFID, 300mm chip on wafer & more. Watch Finetech's short video to see the impressive scope of the Fineplacer bonder…
Finetech
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New Fully Automatic Heavy Wire Bonder
Increases Productivity by 30%
wire bonding in actionProcess aluminum wire, copper and HCR™ (High Currency Ribbon) and set new benchmarks for wire bonding process speed, bonding precision and low maintenance requirements. Learn more…
Hesse & Knipps, Inc.

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