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Mar 9, 2018
Presto Engineering & Maja Systems Announce Joint Collaboration
Presto Engineering Inc. and Maja Systems jointly announce their successful collaboration in comprehensive wafer-level ATE for the Maja AirData™ family of terabit ...
Presto Engineering
Mar 9, 2018
Meyer Burger awarded contracts with a combined order volume for its diamond wire based DW 288 Sapphire cutting system
Meyer Burger Technology Ltd announced that it has successfully concluded strategically important contracts with two existing customers in Asia for the delivery of its ...
Meyer Burger Technology Ltd
Mar 9, 2018
SABIC Expands unique high-temperature film portfolio with launch of New 7 MICRON ULTEM™
SABIC is introducing here at APEC 2018, in booth #1728, a new 7µm (micron) ULTEM™ UTF120 polyetherimide (PEI) dielectric film for high-temperature, professional-grade ...
SABIC
Mar 7, 2018
Smart Manufacturing, Big Data to Highlight ASMC 2018
SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2018) will bring together more than 100 industry experts and feature 35 hours of technical presentations ...
SEMI
Mar 7, 2018
Swivel Lid Spring Pin BGA Socket for LP-DDR4
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing BGA devices - SBT-BGA-7051. The contactor is a stamped ...
Ironwood Electronics
Mar 7, 2018
Leti and Mapper Develop Individualized Chips With Maskless Lithography In CMOS Process
Leti and Mapper Lithography announced a low-cost cyber-security breakthrough that encrypts individual chips with a code. The non-falsifiable code is generated by ...
Leti
Mar 6, 2018
TechSearch International Analysis Shows Packaging for Cryptocurrancy Provides a Windfall
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip chip CSPs and BGAs is expected to provide increased ...
TechSearch International
Mar 6, 2018
StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference
StratEdge Corporation announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference ...
StratEdge Corporation
Mar 6, 2018
Atotech's MultiPlate® for FOPLP at IMAPS Device Packaging Conference
At the upcoming IMAPS Device Packaging Conference 2018, Atotech will speak about the move from Fan Out Wafer Level Packaging (FOWLP) to Fan Out Panel Level Packaging ...
Atotech
Mar 5, 2018
Imec and Cadence Tape Out Industry's First 3nm Test Chip
Imec, and Cadence Design Systems, Inc. announced that its extensive, long-standing collaboration has resulted in the industry's first 3nm test chip tapeout. The tapeout ...
Imec