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Jan 21, 2016
VIEWPOINT 2016: Patrick Donovan Marketing Development Manager, Sonix, Inc.
At Sonix we prioritize our R&D investments to maximize the value of Scanning Acoustic Microscopy (SAM) as a defect inspection solution for MEMS, CMOS Image Sensor (CIS), Wafer Level Packaging (WLP), Advanced Packaged Devices, and Through Silicon Via (TSV) applications. Building on ...
Jan 20, 2016
VIEWPOINT 2016: Luc Van den hove, President and CEO, imec
This year we celebrated 50 years of Moore's Law. As a true visionary, he described how electronic circuits would evolve, treating consumers to ever smaller devices, increased functionality and reduced cost. Innovation in the electronic industry is still phenomenal. Today we are looking at new ...
Jan 19, 2016
VIEWPOINT 2016: Bruce Bolliger, head of sales & marketing, Element Six Tech.
In 2016 Element Six will continue to invest in a number of important applications for chemical vapor deposition (CVD) diamond, including thermal management of semiconductor devices, high power laser optics, attenuated total reflection (ATR) prisms and wastewater treatment. These efforts ...
Jan 15, 2016
VIEWPOINT 2016: NK Chari, Director of Marketing & Support, Keysight Technologies, Inc.
From an industry standpoint, our customers are facing challenging problems, especially issues like test access problems. Our customers are feeling the pressure and asking us for solutions to help reduce their scrap piles, from mobile boards to all sorts of sensor boards. The key here is to take ...
Jan 14, 2016
VIEWPOINT 2016: David Butler, VP Product Management & Marketing, SPTS Tech
"We think 2016 will be a signal year in advanced packaging. A number of projects we have been working on will see significant adoption and growth next year. In 2015, SKHynix, Micron and Samsung took 3D memory die stacking using TSV into production, and AMD was the first chip maker ...
Jan 13, 2016
VIEWPOINT 2016: Dr. Kimberly Pollard, Technology Manager, Dynaloy LLC
Dynaloy is an innovative supplier of photoresist and post etch residue removers. Our focus is on applications requiring surface preparation and organic film or residue removal. By expanding our technology tool box and using custom formulation opportunities over the past 15 years, we've ...
Jan 12, 2016
VIEWPOINT 2016: Peter Dijkstra, Director Sales & Marketing, ASM Laser Separation
ASM Pacific Technology Limited (ASMPT) is a world leader in the supply of semiconductor assembly and packaging equipment and materials, as well as surface mount technology applications. Our broad portfolio of wafer level and panel level technological capabilities enables our customers to meet ...
Jan 11, 2016
VIEWPOINT 2016: Uday Mitra, V.P., Etch and Patterning, Applied Materials
Looking ahead to 2016, I see continued momentum toward a more connected world made possible by advancements in semiconductor technology. The increased complexity of high-performance logic and memory chips combined with continued device scaling will require new materials and more ...
Jan 8, 2016
VIEWPOINT 2016: Rob Kavanagh, Global Business Director, Dow Electronic Materials
The key global trend forecasted in advanced packaging is a migration from fan-in to fan-out wafer-level packaging (FOWLP) to start in 2016 as a method of achieving high connectivity in a small space. With no substrate and thin-film metallization providing interconnections, redistribution layers patterned ...
Jan 7, 2016
VIEWPOINT 2016: John Nelson, Ph.D., Chief Executive Officer, UTAC Group
will be a slow start to 2016 with excess semiconductor inventory taking time to deplete over the first half of 2016. There could be a rebound in customer demand in 2H2016 with the release of new smart phone models although the year-on-year growth in 2016 will be flat to modest. For UTAC, 2015 ...