We search for industry news, so you don't need to.
Press Releases arrow   Page 6 of 495   arrow
Submit a Press Release
Aug 30, 2018
Indium Corporation to Feature InFORMS® Reinforced Solder Preforms at IMAPS 2018
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at IMAPS 2018, Oct. 8-11 in Pasadena, Calif. Indium Corporation is redefining ...
Indium Corporation
Aug 30, 2018
Silicon Designs Now Offering MEMS Variable Capacitive Accelerometer Samples via Amazon
Silicon Designs, Inc. announced that it is now offering MEMS VC accelerometer module samples, in ranges from +/-2 g to +/-100 g, via Amazon.com. This newly established ...
Silicon Designs, Inc.
Aug 28, 2018
North American Semiconductor Equipment Industry Posts July 2018 Billings
North America-based manufacturers of semiconductor equipment posted $2.36 billion in billings worldwide in July 2018, according to the July Equipment Market Data ...
Aug 28, 2018
Virtual Industries' STEALTH-VAC ELITE Kit Provides High Performance Levels
Virtual Industries Inc. features a product line of hand tools that replaces tweezers or other gripping means for many applications. The STEALTH-VAC ELITE operates directly ...
Virtual Industries Inc.
Aug 28, 2018
Indium Features WS-446HF Flip-Chip and WS-823 Ball-Attach Fluxes at SEMICON Taiwan
Indium Corporation will feature its Flip-Chip Flux WS-446HF and Ball Attach Flux WS-823 at SEMICON Taiwan 2018 Sept. 5-7 in Taipei, Taiwan. Indium Corporation's WS-446HF ...
Indium Corporation
Aug 27, 2018
ClassOne sells to largest compound semiconductor fab in China
ClassOne Technology announced a multi-tool sale of its flagship Solstice® CopperMax™ electroplating system to China's premier Compound Semiconductor manufacturer. As ...
ClassOne Technology
Aug 27, 2018
StratEdge Receives ISO 9001:2015 Quality Management Systems Certification
StratEdge Corporation announces that DNV GL -- Business Assurance has found StratEdge Corporation to conform to the Quality Management System standard ISO 9001:2015. ...
StratEdge Corporation
Aug 23, 2018
MRSI Systems launches MRSI-HVM3P for new applications extending the MRSI-HVM3 die bonder family
MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active ...
MRSI Systems
Aug 23, 2018
Clariant introduces pioneering Humitector Type 2 Non-Reversible Humidity Indicator Cards at Semicon Taiwan
Clariant delivers a new level of moisture-exposure assurance to surface mount suppliers and device manufacturers in the Far East, with the regional debut of the first ...
Aug 21, 2018
25 Amp Spring Pin Socket for DC/DC Converter
Ironwood Electronics recently introduced a new socket addressing high current requirements for Dual DC-DC Converter - SBT-DC/DC-9002. The contactor is a spring pin ...
Ironwood Electronics