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Jun 12, 2017
Artificial Intelligence: a new era of the advanced packaging industry
AI is driving the development of 3D TSV and heterogeneous integration technologies. With its new 3D TSV & 2.5D business update report, Yole, part of Yole Group of Companies ...
Yole Développement
Jun 12, 2017
Thin, Defect-Free Coatings for Glass Panels and Substrates Up to 1.2 Meters Wide
When it comes to the thin, uniform deposition of low viscosity coatings to large glass panels, USI's non-contact PRISM-1200 Ultrasonic Spray Coating System is unparalleled ...
Ultrasonic Systems
Jun 9, 2017
Record Fab Spending for 2017 and 2018
The latest update to the World Fab Forecast report, published on May 31, 2017 by SEMI, reveals record spending for fab construction and fab equipment. Korea, Taiwan ...
SEMI
Jun 9, 2017
EpoxySet UC-2524, flame resistant, Urethane
epoxySet formulates a wide variety of Urethane compounds including the UC-2524. The UC-2524 is a flame resistant potting/casting material that is used for environmental ...
EpoxySet
Jun 9, 2017
Element Six Introduces Electrically Conductive CVD Diamond Heat Spreader, Diafilm ETC700
Element Six announced the development of a new thermal grade of synthetic diamond grown by chemical vapor deposition (CVD), Diafilm™ ETC700. The material is both thermally ...
Element Six
Jun 8, 2017
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions
Formulated to meet rigorous Airbus specifications, Master Bond EP93FRHT passes the twelve second vertical burn test per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F ...
Master Bond
Jun 8, 2017
CyberOptics to Demo WaferSense & ReticleSense Technology at SEMICON West
CyberOptics® Corporation will demonstrate the WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) at SEMICON West July 11-13 at the Moscone Center in San Francisco ...
CyberOptics® Corporation
Jun 8, 2017
EnSilica develops sureCore's new, Ultra-Low Power IoT reference platform
EnSilica and sureCore have announced that EnSilica has developed sureCore's new, ultra-low power IoT reference platform targeted principally at the development of the next generation ...
EnSilica
Jun 7, 2017
Germanium Solder Preforms at IMAPS High Temperature Electronics Network (HiTEN) 2017
Indium Corporation will feature its semiconductor-grade gold-germanium solder preforms at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 ...
Indium Corporation
Jun 7, 2017
Atotech presents NovaBond® IT at the JPCA Show 2017
Atotech will introduce NovaBond® IT, its new and innovative non-etching adhesion promoter for IC Substrates and high frequency application inner-layer bonding ...
Atotech Deutschland GmbH