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Aug 8, 2018
India Startup Preps RISC-V, AI Cores
A startup in India announced ambitious plans to design and license RISC-V-based processor cores as well as deep-learning accelerators and ...
EE Times
Aug 8, 2018
The Chiplet Race Begins
Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges ...
Semiconductor Engineering
Aug 7, 2018
The Chiplet Race Begins
Momentum is building for the development of advanced packages and systems using so-called chiplets, but the technology faces some challenges ...
Semiconductor Engineering
Aug 7, 2018
TSMC Sales Hurt by Virus Outbreak
Foundry giant Taiwan Semiconductor Manufacturing Co. (TSMC) said a computer virus outbreak that hit the company on Aug. 3 will ...
EE Times
Aug 7, 2018
First Half Chip Sales Up 20% From 2017
After another strong month of both sequential and annual growth, semiconductor sales through the first half of 2018 were up ...
EE Times
Aug 7, 2018
TSMC's iPhone chip attack is a wake-up call for enterprise security
Apple chipmaker TSMC suffered a serious WannaCry-related ransomware infection that closed down production at some of its factories. The incident ...
Computerworld
Aug 7, 2018
Perspectives on the Cost of Fan-out wafer Level Packaging vs. Flip Chip Packaging
Recently, I read a paper published in the 2017 IMAPS Device Packaging Conference proceedings, titled "Cost Comparison of Fan-out Wafer ...
3D Incites
Aug 7, 2018
YMTC Adds Detail to NAND Plans
Yangtze Memory Technologies Co. (YMTC) revealed more details about its 3D NAND plans ahead of a talk at the Flash ...
EE Times
Aug 7, 2018
Return Of The Organic Interposer
Organic interposers are resurfacing as an option in advanced packaging, several years after they were first proposed as a means ...
Semiconductor Engineering
Aug 7, 2018
Auto Chip Test Getting Harder
Chipmakers and test/validation companies are helping lead the effort to develop self-driving cars, but they are facing a wide range ...
Semiconductor Engineering