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Mar 15, 2018
Indium Corporation's Andy Seager Named European Sales Manager
Based in Milton Keynes, United Kingdom, Seager is responsible for developing and implementing sales strategies for all solder products in Europe. As a member of the European sales leadership ...
Indium Corporation
Mar 15, 2018
Atotech presents new solutions for (a)mSAP applications at CPCA 2018
Atotech confirmed to showcase its latest solutions for (a)mSAP application at the upcoming CPCA show in Shanghai, China, from March 20 through 22, 2018. The company has developed ...
Atotech
Mar 15, 2018
Palomar Tech Introduces 6532HP: Ultra High Accuracy Die Bonding System
Palomar Technologies, Inc. is delighted to announce the introduction of their newest die bonding system: the 6532HP (HP for High Precision, High Production, High Performance). ...
Palomar Technologies, Inc.
Mar 15, 2018
Apple selected substrate-like PCBs for its latest iPhones. Who's next?
The semiconductor industry's trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and ...
Yole Développement
Mar 14, 2018
Silicon photonics industry is at the very beginning of a massive deployment
"Si photonics growth is now confirmed", announces Dr. Eric Mounier from Yole Développement. "Therefore, the development of Si photonics technologies is especially ...
Yole Développement
Mar 14, 2018
Fab Spending Poised For Remarkable Fourth Year of Growth
The latest update to the SEMI World Fab Forecast report, published on February 28, 2018, reveals fab equipment spending will increase at 5 percent in 2019 for a remarkable ...
SEMI
Mar 14, 2018
SmartKem Unveils 'Technology for Life' Campaign
SmartKem has launched its innovative Technology For Life campaign. The Technology For Life campaign will highlight how recent end-user-driven advances in display technology ...
SmartKem
Mar 13, 2018
USI Webinar: How tCAT slashes the Cost of Ultra-Think Package-Level EMI Sheild Coatings
Package-level EMI (electromagnetic interference) shielding is increasingly important as highly sensitive components become more tightly packed in circuit assemblies. ...
Ultrasonic Systems, Inc.
Mar 13, 2018
Phononic Launches Non-Hermetic Compatible Thermoelectric Cooler Platform for Reliable, High Performance Laser Packages
Phononic unveiled its proprietary Non-Hermetic Compatible Thermoelectric Cooler (TEC) Platform designed to provide high reliability and cooling performance, coupled ...
Phononic
Mar 13, 2018
Marvin Test Solutions Announces Contract Award for A-10/C Flightline Test Sets
Marvin Test Solutions, Inc. (MTS) announced that it has been awarded an $8.6M Firm-Fixed-Price (FFP) contract by the U.S. Air Force to provide chassis and instrumentation ...
Marvin Test Solutions, Inc.