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Oct 5, 2018
Apple, Amazon deny Bloomberg report on Chinese hardware attack
Apple Inc and Amazon.com Inc denied a Bloomberg Businessweek report that said their systems had been infiltrated by malicious computer ...
Reuters
Oct 5, 2018
TSMC announces OIP ecosystem enabled in the cloud
Taiwan Semiconductor Manufacturing Company (TSMC) has announced the initial availability of its Open Innovation Platform Virtual Design Environment and the ...
Digitimes
Oct 5, 2018
Global smartphone shipments to be under 1.5 billion units in 2019
Global smartphone shipments are likely to be capped below 1.5 billion units in 2019 as the emerging 5G-enabled phones have ...
Digitimes
Oct 5, 2018
IC designers see pickup in orders for new Android phones
Taiwan-based IC design houses have seen chip orders for Android smartphones pick up recently as China brand vendors including Huawei, ...
Digitimes
Oct 5, 2018
SK Hynix boosts investment in new South Korean chip factory
SK Hynix Inc said it would invest $17.8 billion)in a new memory chip manufacturing plant opening in South Korea, about ...
Reuters
Oct 5, 2018
Nanya 3Q18 revenues slip
DRAM chipmaker Nanya Technology saw its third-quarter revenues slip nearly 1% on quarter, which came below market watchers' expectation of ...
Digitimes
Oct 4, 2018
DRAM Market Braces For Slower Growth
In its September Update to The 2018 McClean Report, IC Insights discloses that over the past two years, DRAM manufacturers ...
IC Insights
Oct 4, 2018
TSMC's Chang to lead APEC crew
Taiwan Semiconductor Manufacturing Co founder Morris Chang is to be the nation's representative to next month's APEC leaders' summit in ...
Taipei Times
Oct 4, 2018
A new brain-inspired architecture could improve how computers handle data and advance AI
IBM researchers are developing a new computer architecture, better equipped to handle increased data loads from artificial intelligence. Their designs ...
Phys.org
Oct 4, 2018
ASE gearing up for FOPLP
Advanced Semiconductor Engineering (ASE) under ASE Technology Holding is expected to make significant progress on its fan-out panel-level packaging (FOPLP) ...
Digitimes