We search for industry news, so you don't need to.
Press Releases arrow   Page 5 of 495   arrow
Submit a Press Release
Sep 6, 2018
X-FAB Doubles 6-Inch SiC Foundry Capacity in Response to Customer Demand
X-FAB Silicon Foundries SE announced plans to double their 6-inch Silicon Carbide (SiC) process capacity at its fab in Lubbock, Texas in response to increased customer ...
Sep 5, 2018
Indium Corporation Expert to Present at TechXPOT at SEMICON Taiwan
Indium Corporation's Jason Chou, Area Technical Manager for Taiwan, will share his technical expertise at TechXPOT at SEMICON Taiwan 2018 on Sept. 6 in Taipei, Taiwan ...
Indium Corporation
Sep 5, 2018
Atotech to exhibit and present at the SEMICON Taiwan
Atotech announced its participation at this year's SEMICON Taiwan Show, held from September 5 to 7, 2018, in the Taipei Nangang Exhibition Center Hall 1 in Taipei, Taiwan ...
Atotech Group
Sep 5, 2018
Rudolph Technologies Launches Second-Gen Dragonfly Inspection and Metrology System
Rudolph Technologies, Inc. announced its new Dragonfly™ G2 platform, which incorporates many of the benefits of the Firefly™ system onto the Dragonfly platform, ...
Rudolph Technologies, Inc.
Sep 5, 2018
SEMI Europe and AENEAS Collaborate to Support European Electronics Industry Growth
SEMI Europe and AENEAS announced that they have signed a Memorandum of Understanding (MOU) to form a strategic partnership to support the European electronics ...
Sep 4, 2018
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3mm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used ...
MRSI Systems
Sep 4, 2018
Nordson ASYMTEK Receives ISO 9001:2015 Quality Management Systems Certification
Nordson ASYMTEK a Nordson company announces that it has received ISO 9001:2015 Quality Management System certification from DNV GL. The certificate scope covers The Design...
Sep 4, 2018
Edwards to expand Semiconductor offering with the planned addition of Brooks Automation's cryogenic business
Atlas Copco Group has announced its agreement to acquire the cryogenic business of Brooks Automation, Inc through its wholly owned US entity Edwards Vacuum LLC. Once ...
Edwards Vacuum
Sep 4, 2018
Atotech to present and exhibit at the 38th IEMT Conference
Atotech announced that it will participate in the 38th International Electronics Manufacturing Technology (IEMT) Conference 2018 with a booth (booth no. 20) and a paper ...
Atotech Group
Aug 30, 2018
MRSI Launches new MRSI-H3TO Die Bonding Product Family
MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3mm high speed die bonder which will be the first of its kind to address the multi-die and multi-process ...
MRSI Systems