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Jan 15, 2018
Big Bets on A.I. Open a New Frontier for Chip Start-Ups, Too
For years, tech industry financiers showed little interest in start-up companies that made computer chips. How on earth could a ...
The New York Times
Jan 15, 2018
UMC files lawsuit against two Micron subsidiaries
United Microelectronics Corp said it has filed a patent infringement lawsuit against Micron Technology Inc's subsidiaries in China, seeking US$41.85 ...
Taipei Times
Jan 15, 2018
2018 Outlook for Advanced Packaging Materials
Advanced packaging is moving mainstream as manufacturers continue to seek ways to improve device performance beyond traditional scaling. The semiconductor ...
3D Incites
Jan 15, 2018
GM Says: Look, Ma, No Steering Wheel
No steering wheel. Or pedals. That's how the self-driving car from GM's Cruise will be fitted when it hits the ...
IEEE Spectrum
Jan 15, 2018
The Week In Review: Manufacturing
Intel and Micron have ended their long-running NAND joint development partnership. The companies will continue to develop NAND, but they ...
Semiconductor Engineering
Jan 15, 2018
MediaTek Pushes AI to the Edge
MediaTek demonstrated at the Consumer Electronics Show its readiness for the post-smartphone era by moving into several new sectors, including ...
EE Times
Jan 15, 2018
Intel says patches can cause reboot problems in old chips
Intel Corp on Thursday said that recently issued patches for flaws in its chips could cause computers using its older ...
Reuters
Jan 15, 2018
Explainer: How chip flaws Spectre, Meltdown work and what's next
Smartphones, PCs and servers across the world have received software updates in recent days to plug security gaps on computer ...
Reuters
Jan 15, 2018
Cleanliness is Close to Godliness for Carbon Nanotubes
Scientists at Rice and Swansea universities used tungsten probes attached to a scanning tunneling microscope to test the conductivity of ...
IEEE Spectrum
Jan 15, 2018
Is MEMS Packaging and Test the Next Opportunity for OSATs?
More than half of microelectromechanical systems MEMS packaging today is done by outsourced semiconductor and test services providers (OSATs) and ...
3D Incites