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May 8, 2017
Brewer Science Announces Sale of Equipment Unit
Brewer Science is pleased to announce that its Cee® semiconductor processing equipment business unit has been sold. Former Brewer Science employee, Russ Pagel, has ...
Brewer Science
May 8, 2017
Two GORE® Foam Liners Set New Standards for Enhanced Packaging Safety and Versatility
W. L. Gore & Associates introduces two Foam Liners that set new standards for safety and versatility in packaging hazardous chemicals, agrochemicals, institutional ...
W. L. Gore & Associates Inc.
May 5, 2017
Dynatex International's temporary adhesive WaferGrip prevents backside chipping
LTCCs are bonded by hand to glass plates for dicing. This process creates Voids that lead to Backside Chipping. WaferGrip provides a uniform thickness that can ...
Dynatex International
May 5, 2017
StratEdge Semiconductor Packages Now Sold on Amazon.com
StratEdge Corporation announces the opening of its Amazon Store to sell its off-the-shelf high-frequency packages. "It is a relatively new concept to use Amazon ...
StratEdge Corporation
May 5, 2017
Yincae at SEMICON West, Booth 5248
The SEMICON West 2017 is less than two weeks away! SEMICON West 2017 will be held at the Moscone Center in San Francisco, CA from July 12th to 14th. We sincerely ...
YINCAE Advanced Materials, LLC
May 4, 2017
Clamshell Production Test Socket for ASE's FC BGA1164
Ironwood Electronics recently introduced a new Stamped spring pin socket addressing high performance requirements for testing BGA1164 - CBT-BGA-7042. The contactor ...
Ironwood Electronics
May 4, 2017
Indium to Feature MEMS Microphone Lid-Attach Indium8.9HF Solder Paste at MEMS and Sensors Technology Symposium
Indium Corporation will feature its MEMS microphone lid-attach Indium8.9HF Solder Paste at MEPTEC's 15th Annual MEMS and Sensors Technology Symposium on June 6 ...
Indium Corporation
May 4, 2017
Rudolph Announces Orders for its Newly-Announced Firefly Inspection System
Rudolph Technologies, Inc. announced that two of the industry's leading suppliers of advanced packaging services have purchased multiple Firefly™ Inspection Systems. ...
Rudolph Technologies, Inc.
May 3, 2017
ZEISS Files Patent Infringement Lawsuits Against Nikon
ZEISS announced that it is filing initial legal claims against Nikon for infringement of more than ten patents, related to a broad range of products in the fields ...
Zeiss
May 3, 2017
ASML files patent infringement lawsuits against Nikon
ASML announced that it is filing initial legal claims against Nikon for infringement of more than 10 patents, related to a broad range of products in the fields ...
ASML