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Feb 9, 2018
Leti Chief Scientist Barbara De Salvo Will Help Kick Off ISSCC 2018 with Opening-Day Keynote
Leti Chief Scientist Barbara De Salvo will help kick off ISSCC 2018 with an opening-day presentation calling for radically new, digital-communication architecture ...
Leti
Feb 9, 2018
Annual Silicon Volume Shipments Remain at Record Highs
Worldwide silicon wafer area shipments in 2017 increased by 10% against 2016 shipments, while worldwide silicon revenues rose by 21 percent over 2016 levels ...
SEMI
Feb 8, 2018
Indium Corporation Senior Product Manager to Present at APEC 2018
Indium Corporation's Andy C. Mackie, PhD, MSc, Senior Product Manager, Semiconductor and Advanced Assembly Materials, will present at APEC 2018, March 4-8 ...
Indium Corporation
Feb 7, 2018
Henkel and Holst Centre continue collaboration
Henkel and Holst Centre today announced the extension of their fruitful longterm collaboration, which focuses on developments related to health patch technologies and products. ...
Holst Centre
Feb 7, 2018
Leti Presents Optical-Equipment Curving Technology that Improves Performance, Cuts Costs
Leti has developed a new curving technology for optical sensors and micro-displays that improves performance, enhances field of view and compensates for aberrations ...
Leti
Feb 6, 2018
BGA SMT Emulation Adapter Set Allows Affordable, Reliable Socketing of Xilinx FF1153 ICs
Ironwood Electronics is introducing SF-BGA1153A-B-42F and LS-BGA1153A-41 BGA SMT adapter set, a low cost and reliable socket for Xilinx 1153 pin BGA ICs. The adapter ...
Ironwood Electronics
Feb 6, 2018
SE 8 Enclosures Offer Better Value and Durability Than Unibody Enclosures
Rittal North America LLC introduces the SE 8 line of stand-alone enclosures. The new SE 8 combines the interior space efficiency of modular designs with a price ...
Rittal North America LLC
Feb 5, 2018
Nordson MARCH's MesoSPHERE Plasma System for high-throughput semiconductor packaging
Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out ...
Nordson MARCH
Feb 5, 2018
MicroLED displays: the patent landscape reflects the dynamism of the sector
This year again, the Las Vegas Consumer Electronics Show, 2018 edition allowed us to discover the latest innovations in numerous fields including the microLED displays ...
Yole Développement
Feb 5, 2018
Marvin Test Solutions Announces New SmartCan™ Orders
Marvin Test Solutions, Inc. announced that it has received new contracts for its MTS-3060 SmartCan™ from multiple international customers to support armament systems ...
Marvin Test Solutions, Inc.