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May 16, 2017
3D imaging & sensing technologies: an expected explosion within the consumer market segment
"Beyond its traditional medical and industrial markets, 3D imaging & sensing is ready to conquer consumer and automotive sectors", explains Pierre Cambou ...
Yole Développement
May 16, 2017
Tianma NLT USA Introduces Thin and Lightweight Industrial 15.0-inch LCD module
Tianma NLT USA has announced the introduction of a thin and lightweight 15.0-inch diagonal LCD module with XGA resolution (1024 x 768 pixels, P/N NL10276AC30-53D) ...
Tianma NLT USA
May 15, 2017
PXI and LXI Switching Solutions and Signal Routing Software at SEMICON WEST
Pickering Interfaces will showcase their latest high-density PXI and Ethernet LXI Switching Solutions along with their Signal Routing Software at SEMICON West ...
Pickering Interfaces
May 15, 2017
New 'Thought Leadership Pass' Unlocks What’s Smart at SEMICON West 2017
SEMI announced that SEMICON West (July 11-13 in San Francisco, Calif.) experience packages are now available for purchase, allowing attendees to choose the programs ...
May 15, 2017
Tianma Selects Orbotech Solutions for its Flex AMOLED Gen 6 Fab
Orbotech Ltd. announced that Tianma Micro-electronics Co. Ltd. has selected Orbotech's ArrayChecker™ and Automated Optical Inspection (AOI) solutions for its production...
Orbotech Ltd.
May 12, 2017
Ultrasonic Systems Inc Launches PRISM-1200 Spray Coating System
Ultrasonic Systems, Inc. announced the PRISM-1200, a hight-speed, high performance spray coating system designed for demanding glass panel coating applications ...
Ultrasonic Systems Inc
May 12, 2017
2017FLEX Korea ─ First Flexible Hybrid Electronics Conference in Korea
Today FlexTech, A SEMI Strategic Association Partner, announced the full agenda for the inaugural flexible hybrid electronics (FHE) conference coming up on May 31-June 1 ...
May 12, 2017
Holst Centre wins IDTechEx Printed Electronics Europe 2017 Award
At the 13th IDTechEx Printed Electronics Europe conference and exhibition in Berlin, Holst Centre received the Best Institute/Academic R&D Award for a functional ...
Holst Centre
May 11, 2017
Enabling Technologies, Platforms, Proliferations A New Way of Working Structure for LED Product Development
This paper presents an overview of an approach MAX I.E.G. executed to reduce the product development cycle time for a major integrated LED manufacturer. The core ...
May 11, 2017
UnitySC Announces Wafer Thinning Inspection System; Win from Power Semiconductor IDM for Automotive
UnitySC announced multiple orders from a leading integrated device manufacturer (IDM) for its modular 4See Series automated defect inspection platform. The systems ...