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Oct 30, 2017
SEMICON Japan Brings Smart Applications and IoT
SEMI announced that SEMICON Japan will focus on smart applications as key drivers of the electronics industry. Over 30,000 attendees are expected to convene at SEMICON Japan ...
Oct 27, 2017
Semblant to Present at Semiconductor and Material Events in Fourth Quarter of 2017
Semblant will be speaking at three major semiconductor and materials conferences during the remainder of the 4th quarter. Separate presentations will be delivered ...
Oct 27, 2017
Power GaN: everything is place for volume production
"The GaN market promises an imminent growth", announces Dr. Ana Villamor, Technology & Market Analyst from Yole. "2015 and 2016 have been undoubtedly exciting years ...
Yole Développement
Oct 27, 2017
Meyer Burger awarded major strategic contract by an Italian photovoltaic manufacturer
Meyer Burger's high performance Heterojunction (HJT) solar cell coating technology has been selected for the installation of a manufacturing line to produce ...
Meyer Burger
Oct 26, 2017
Technic Expands Semiconductor Specialty Chemical Manufacturing in US
Technic announces the expansion of its semiconductor specialty chemical business with the acquisition of a 35,000 square foot facility in Woonsocket, Rhode Island. ...
Oct 26, 2017
aveni® S.A. Raises $10.5M to Commercialize its Innovative Metallization Technologies
aveni S.A. announced it has completed a $10.5M capital raise from Merck Ventures, the corporate venture arm of Merck, along with existing investors. "This new ...
aveni S.A.
Oct 26, 2017
The automotive electronics industry explodes: when cars become smarter...
For years, the automotive electronics industry has been undergoing a massive transformation, not seen since its creation more than 100 years ago. Autonomous driving ...
Yole Développement
Oct 25, 2017
Dow Corning® TC-5888 Thermally Conductive Compound Improves Production, Performance and Reliability
Dow Corning introduced new Dow Corning® TC-5888 Thermally Conductive Compound. The latest addition to the Company's broad and growing portfolio of solutions for thermal ...
Dow Corning
Oct 25, 2017
UnitySC Announces Opening of Austin Global Software Development Center
UnitySC announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company's new global ...
Oct 25, 2017
EMS Launches Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Engineered Material Systems, Inc. is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level ...
Engineered Material Systems, Inc.