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May 24, 2017
Amkor Technology Completes Acquisition of NANIUM
Amkor Technology, Inc. announced that it has completed the acquisition of NANIUM S.A., a world class provider of wafer-level fan-out (WLFO) semiconductor packaging ...
Amkor Technology, Inc.
May 24, 2017
Leti Will Demo World's-first WVGA 10-µm Pitch GaN Microdisplays at Display Week
Extending its expertise in high-brightness microdisplay technology for augmented-reality and other applications, Leti will demonstrate the world's first wide video ...
May 24, 2017
Ultratech Receives Multiple Laser System Order To Ramp Advanced FinFET Production From Major Customer In Asia
Ultratech, Inc. announced that it has received a multiple system follow-on order for its LSA101 dual-beam laser spike anneal (LSA) systems. Ultratech's millisecond ...
Ultratech, Inc.
May 23, 2017
Imec and Holst Centre Present Solution for Precise Low-Cost Eye Movement Detection
Imec and Holst Centre (set up by imec and TNO) announced the development of a sensing technology to detect eye movement in real time based on electrical sensing. Paving ...
May 23, 2017
Technology Partners at SEMICON West Focus on Innovations Driving Industry Growth
SEMI announced its plans to deliver specialized programs at SEMICON West 2017 in partnership with IEEE, Society of Automotive Engineers International (SAE), and imec. ...
May 23, 2017
MEMS industry: RF is changing the game...
With the apparition of 4G and complexification leading to increasing demand for filters, RF is restructuring the MEMS industry. A new MEMS player has entered the Top 3 ...
Yole Développement
May 22, 2017
Imec Introduces First Thin-Silicon Implantable Chip for High-Precision Haptic Prosthetics
Imec announced its success in fabricating a prototype implantable chip that aims to give patients more intuitive control over their arm prosthetics. The thin-silicon ...
May 22, 2017
Plasma-Therm Wins 'RANKED 1st' Awards in Customer Satisfaction
For the 19th year, Plasma-Therm has been recognized for the quality of its systems and customer support as shown by a global survey of customers throughout the semiconductor ...
Plasma-Therm LLC
May 22, 2017
Gore Automotive Vents Introduces a New Adhesive Vent
With its new AVS 110 adhesive vent, W. L. Gore & Associates integrates innovative performance benefits into a smaller, 5 mm footprint. This small-diameter, low-profile ...
W. L. Gore & Associates Inc.
May 19, 2017
New applications are driving materials & design innovations for power module packaging
The power packaging materials is today the main part of the power module cost. Therefore, in 2016 almost 40% of the total cost is due to the cost of materials for packaging. ...
Yole Développement