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Aug 9, 2017
One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specs
Developed for priming and bonding polyolefinic substrates, Master Bond X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. ...
Master Bond
Aug 9, 2017
ISSI Receives Bosch Global Supplier Award
Integrated Silicon Solution, Inc. (ISSI) has been honored with the Bosch Global Supplier Award from Robert Bosch GmbH. ISSI received the award in the Innovation ...
Integrated Silicon Solution, Inc. (ISSI)
Aug 9, 2017
Infrared laser: At the heart of the industry in coming years
In a depressed visible LED industry, manufacturers are looking at new opportunities to increase their revenues and margins. In this context, the IR LED market is perceived ...
Yole Développement
Aug 8, 2017
Infrared imaging: 'We need to look even further...'
Uncooled IR imaging market has been initially driven by defense applications. Then innovation and cost reduction enabled the implementation of a new commercial market ...
Yole Développement
Aug 8, 2017
Esgee Technologies Releases OverViz 2.2 for Solving Hybrid Plasma-Fluid-Electromagnetic-Particle Simulations
Esgee Technologies Inc. is excited to announce the release of OverViz Simulation Suite v2.2. OverViz is a validated multiphysics tool suite that provides industry leading ...
Esgee Technologies Inc.
Aug 8, 2017
Nanusens solves the problem of stiction in MEMS inertial sensors
Nanusens has announced that its CMOS nano-sensor technology has been successfully used to solve the problem of stiction in MEMS inertial sensors, which is a major ...
Aug 7, 2017
EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan
EV Group (EVG) announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama ...
EV Group
Aug 7, 2017
Advances in Thin, 3D and MEMS Die Bond Strength Testing
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond ...
Aug 7, 2017
SiC technologies adoption is going to accelerate with a tipping point in 2019
SiC power business is concrete and real, with a promising outlook... That is what Yole Développement's analysts said in 2016. The trend has not changed in 2017 ...
Yole Développement
Aug 4, 2017
Multitest MiCon® Contactor: Advantages of Cantilever Design for MCU and ASIC Testing
Multitest recently launched the MiCon contactor. The MiCon leverages the industry-proven Cantilever technology for the final test of Microcontrollers, Industrial DSPs ...