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Jun 5, 2017
WorleyParsons China wins engineering design contract for major polysilicon manufacturer
WorleyParsons China has been awarded a detailed engineering design contract with a major global polysilicon manufacturer. The 10-month project will see ...
Jun 5, 2017
ZESTRON Launches New Website
ZESTRON is pleased to announce the new, mobile responsive zestron.com is live. "With this launch our website is mobile responsive, allowing it to be compatible with both mobile ...
Jun 2, 2017
Micro-Measurements Introduces Transducer Class Multi-Grid Strain Sensors
The Micro-Measurements® brand of Vishay Precision Group, Inc. announced the introduction of its S5060 Series, a new line of Transducer Class® multi-grid ...
Jun 2, 2017
ams broadens smart lighting management offerings with standalone solution for color stability and lumen maintenance
ams introduced the AS7220 Smart Lighting Manager, which enables a new generation of higher-quality LED-based lamps and luminaires by using closed-loop sensing to maintain ...
ams AG
Jun 2, 2017
When homes & buildings become smart
The smart homes and buildings market segment is ready for take-off. "We are currently at the very beginning of the smart homes and buildings adoption curve," asserts ...
Yole Développement
Jun 1, 2017
The Ultimate Coverage in Coating Systems
USI's PRISM-500 and PRISM-800 Programmable Coating Systems deliver a thin, uniform, defect-free coating with our proprietary nozzle-less ultrasonic technology ...
Ultrasonic Systems Inc
Jun 1, 2017
EV Group Expands Production Capacity at Corporate Headquarters in Austria
EV Group (EVG) announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment ...
EV Group
May 31, 2017
Amkor Technology Announces Opening of Korean Sales Office
Amkor Technology has opened a new sales office in Seoul, Korea. The establishment of this new location demonstrates Amkor's commitment to support new and existing ...
Amkor Technology, Inc.
May 31, 2017
Indium Expert to Present at China Semiconductor Packaging Test Symposium 2017
Indium Corporation's Leo Hu, Area Technical Manager, will present at the China Semiconductor Packaging Test Symposium (CSPT) on June 21-23 in Jiangyin, China. Hu's ...
Indium Corporation
May 31, 2017
SEMI | FlexTech and CPEIA Announce Partnership at CPES2017
SEMI | FlexTech and the Canadian Printable Electronics Industry Association have signed a Memorandum of Understanding to support each other's programs and drive the continued ...