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Feb 8, 2016
VIEWPOINT 2016: Sven Wedekin, VP-General Manager, GPD Global, Inc.
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As a manufacturer of Precision Fluid Dispensing systems, automated, bench-top and pumps/valves, we continue to evolve our product line to stay in tune with customer requirements for deposition of materials. We are continually presented with applications across a broad spectrum of industries ...
Feb 4, 2016
VIEWPOINT 2016: Greg DeLarge, President, Plasma Etch, Inc.
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2016 is lining up to be an exciting year for PlasmaEtch! We continue to see strong growth in small machine sales. We have some exciting developments in the plasma coating space that will drive sales and improve market share as we roll into 2016. We will be demonstrating our industry leading plasma ...
Feb 3, 2016
VIEWPOINT 2016: Joseph Fjelstad, President and Founder, Verdant Electronics
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Verdant Electronics will continue to advocate for the manufacture of electronic assemblies without the use of solder. It has licensed firms in Asia and the US to its patent portfolio and is in discussions with others. The company continues to believe the methods described in the patents will ultimately prove ...
Feb 2, 2016
VIEWPOINT 2016: Neil O'Brien, General Manger, Finetech
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In preparation for 2016 and coming years, Finetech laid the groundwork in 2015 for our next generation of technology and launched the future of our manufacturing capability. We are now producing our die bonders from a newly constructed production and development center in Berlin, Germany. This ...
Feb 1, 2016
VIEWPOINT 2016: Rozalia Beica, Chief Technology Officer, Yole Développement
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As we ring in 2016, there are several advanced packaging trends worth tracking. Yole Développement (Yole) outlook is for solid growth for many platforms within this market: according to Yole's analysts, this market will reach US$30 billion by 2020. Fan-out wafer-level packaging is currently ...
Jan 28, 2016
VIEWPOINT 2016: David Fisher, Senior Vice President, KLA-Tencor Corp.
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In 2016, KLA-Tencor will differentiate itself by introducing technologies that drive new systems for mask, IC device, bare wafer and packaging inspection. Second, continue to develop process control solutions that utilize multiple inspection/metrology systems and advanced data analysis to help IC ...
Jan 27, 2016
VIEWPOINT 2016: Greg Heras, Director of Sales, CoorsTek
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The miniaturization movement and the rise in the use of copper wire have continued to drive innovations in the semiconductor packaging industry. CoorsTek Gaiser® has always been at the forefront of new technology development. In 2016, CoorsTek Gaiser proudly introduces the RF4 ...
Jan 26, 2016
VIEWPOINT 2016: Denny McGuirk, President and CEO, SEMI
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The pace of consolidation in 2015 was unprecedented, making the industry both narrower and deeper. Continued collaboration through the extended supply chain is seen as an enabler as we look down the road towards 2020. Worldwide semiconductor capital expenditure for 2015 is expected ...
Jan 25, 2016
VIEWPOINT 2016: Doug Dixon, Global Marketing Director, Henkel Electronics Materials, LLC
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With China becoming increasingly more important in the semiconductor industry, as evidenced by the recent high-profile acquisitions, Henkel continues our keen focus on this region. Our China-based salesforce has tripled and we have earmarked more R&D resources for technology development ...
Jan 22, 2016
VIEWPOINT2016: Bill Moffat, CEO, Yield Engineering Systems, Inc.
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The semiconductor industry's exponential rise in Fan-Out Wafer Level Packaging (FOWLP) has created numerous opportunities for semiconductor equipment manufacturing companies including Yield Engineering Systems, Inc. (YES). YES is quickly increasing in revenue and employee size due ...