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Dec 22, 2017
List Announces New Artificial Intelligence Technology
List, a research institute of CEA Tech focused on smart digital systems, will demonstrate a new human-machine interaction system at CES 2018 that enhances the immersive ...
CEA Leti
Dec 21, 2017
ISS Europe 2018 to Focus on Winning in the Global Marketplace
Electronics manufacturing executives will sharpen their competitive edge in Dublin, Ireland, on 4-6 March at Europe's SEMI Industry Strategy Symposium. The three-day ...
Dec 21, 2017
The microfluidics industry: the acquisition game
IDEX Health & Science announced at the beginning of December the acquisition of thinXXS, a German microfluidic devices manufacturer. This acquisition follows another ...
Yole Développement
Dec 21, 2017
SEMICON Japan 2017 Overview from DKN Research
SEMICON JAPAN 2017 was held at Tokyo Big Sight earlier this month. This is the last trade show for the electronics industry in 2017. The show use to be held ...
DKN Research
Dec 20, 2017
Esgee Technologies Releases New OverViz Blog for Multiphysics Simulation
Esgee Technologies Inc is excited to announce the release of our new OverViz Blog. The bog is a growing collection of news articles, press releases, application examples ...
Esgee Technologies Inc.
Dec 20, 2017
EV Group Complete Latest Phase of Production Capacity Expansion at Corporate Headquarters
EV Group announced that it has completed construction and opened a new building at its corporate headquarters in Austria to expand capacity for producing its ...
EV Group
Dec 19, 2017
Largest SEMICON China Ever Targets Industry Growth
More than 70,000 players in the electronics manufacturing industry are expected to descend upon SEMICON China for technology and innovation insights to accelerate ...
Dec 19, 2017
Consultation procedure at the production location in Thun has been completed
Meyer Burger Technology Ltd announced a cost efficiency programme on 2 November 2017 which included plans to discontinue all manufacturing activities in Thun ...
Meyer Burger
Dec 18, 2017
ams launches NFC smart sensor IC for traceable, accurate and disposable wireless temperature loggers
ams introduced the AS39513, an NFC sensor tag and data logger IC for smart labels which enables more efficient and accurate monitoring of the condition of assets ...
ams AG
Dec 18, 2017
CES - Leti Will Demonstrate First 3D Anti-Crash Solution for Embedding in Drones
Leti will demonstrate the world's first low-power, low-cost 3D anti-crash, fusion-sensor solution for drones at CES 2018 in Las Vegas. Leti's 360Fusion software, in combination ...