We search for industry news, so you don't need to.
Press Releases arrow   Page 4 of 512   arrow
Submit a Press Release
Dec 6, 2018
SEMI Welcomes Efforts to Reduce U.S.-China Trade Tensions
SEMI applauded the United States and China for agreeing to take first steps to reduce trade tensions. The U.S. plans to delay tariff increases on $200 billion worth ...
SEMI
Dec 6, 2018
CEA-Leti Moves 3D Sequential Integration Closer to Commercialization
Leti has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability ...
CEA-Leti
Dec 6, 2018
Emerging NVM : PCM finally takes off in stand-alone applications
Ever-growing data generation driven by mobile devices, the cloud, the IoT , and big data, as well as novel AI applications, all part of the megatrends, requires ...
Yole Développement
Dec 6, 2018
Marktech Optoelectronics Announces Multi-wavelength Emitters, Detectors and LEDs
Marktech Optoelectronics, Inc. announced its dedicated offerings for wearables. Marktech's standard and custom emitters and detectors, in both multi-wavelength and hybrid ...
Marktech Optoelectronics, Inc.
Dec 5, 2018
Palomar Technologies Offering Silver Sintering to Meet the Needs for RF GaN Power Amplifiers
Palomar Technologies announced new epoxy die attach capabilities for silver sintering. Developed to meet growing demands for RF GaN power amplifiers, which are ...
Palomar Technologies, Inc.
Dec 5, 2018
Worldwide Semiconductor Equipment Billings Drop to $15.8 Billion in Third Quarter 2018, SEMI Reports
SEMI reported that third quarter 2018 worldwide semiconductor manufacturing equipment billings dropped 5 percent from the previous quarter to US$15.8 billion but are 11% ...
SEMI
Dec 5, 2018
Automotive lighting: new SSL technologies integration is transforming the industry
"The growth of the automotive lighting market is driven by natural LED cost erosion coupled with standardization and optimization of LED modules, which result in more ...
Yole Développement
Dec 5, 2018
Perforce and Methodics Deliver Fully Integrated Solution For Semiconductor Design
Perforce Software announced a more advanced integration and strategic partnership with Methodics Inc, the leading provider of enterprise-wide IP Lifecycle Management ...
Perforce Software
Dec 4, 2018
EV Group Unveils Next-Generation Fusion Wafer Bonder
EV Group introduced the all new BONDSCALE™ automated production fusion bonding system. BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer ...
EV Group
Dec 4, 2018
Allchips cooperate with China Mobile about IOT development
Allchips has reached strategic cooperation with China Mobile, to promote the development of IoT in China. Along with the rapid development of China's ecosystem and ...
Allchips Limited