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Nov 3, 2017
Mega Fluid Systems' New MegaSafe Control Software Adds Fail-Safe Feature to Chemical and Slurry Dispense Tools
Mega Fluid Systems, Inc. announced the availability of its new MegaSafe™ control software designed to maintain global loop dispense to point-of-use chemical mechanical ...
Mega Fluid Systems, Inc.
Nov 3, 2017
UltraSoC embedded analytics selected by ELVEES for video, security and safety applications
UltraSoC announced that ELVEES has licensed UltraSoC's embedded analytics technology for use in its next-generation video processing offerings. The new ELVEES ...
Nov 3, 2017
Meyer Burger is optimising manufacturing footprint and product portfolio
Meyer Burger Technology Ltd announced that it has initiated a cost efficiency programme to optimise manufacturing costs and further concentrate its product portfolio. ...
Meyer Burger
Nov 2, 2017
Amkor Technology Reports Financial Results for the Third Quarter 2017
Amkor Technology, Inc. announced financial results for the third quarter ended September 30, 2017. "We achieved record sales in the third quarter, up 15% sequentially ...
Amkor Technology
Nov 2, 2017
ams launches NFC Sensor Interface for Industrial IoT
ams released the AS3956, a dynamic NFC tag IC which meets industrial-grade quality standards and provides very high reliability in mission-critical applications ...
ams AG
Nov 2, 2017
SV TCL Acquisition finalized by Nidec-Read Corporation
SV Probe Pte Ltd announced that Ellipsiz Ltd and Nidec-Read Corporation have finalized a Sales & Purchase Agreement to sell 100% of its ordinary shares in SV Probe Pte ...
SV Probe Pte Ltd
Nov 1, 2017
SEMI FlexTech Selects PARC to Build UltraThin, Flexible Audio Speaker
FlexTech announced a new development project with PARC, a Xerox company, to develop a hybrid, highly bendable, paper-like smart tag, incorporating a thin audio speaker ...
Nov 1, 2017
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f ...
Master Bond
Nov 1, 2017
Memory packaging market is showing a steady growth driven by the memory semiconductor business explosion
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135 billion by 2022 ...
Yole Développement
Oct 31, 2017
Nordson DAGE Announce 2017 European X-ray Distributor Award Winners
Nordson DAGE is pleased to announce their European X-ray Award winners for 2017. The Awards were presented during a three-day X-ray Distributor Conference, which covered Nordson DAGE's ...
Nordson DAGE