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Jun 19, 2017
Indium Corporation Expert to Present at Microelectronics Tech Asia Singapore
Indium Corporation's Jason Chou, Area Technical Manager for Taiwan, will share his technical expertise at Microelectronics Tech Asia Singapore, July 4-5, 2017 in Singapore. ...
Indium Corporation
Jun 16, 2017
Imec World-First to Develop 200V and 650V dispersion free normally-off/e-mode Power Devices on 200mm/8-inch Si Wafers
Imec announced that it has developed 200V and 650V normally-off/enhancement mode (e-mode) on 200mm/8-inch GaN-on-Silicon wafers, achieving a very low dynamic Ron ...
Imec
Jun 16, 2017
Gore Showcasing Solutions for Aerospace Applications at the 2017 Int'l Paris Air Show
W. L. Gore & Associates, Inc. will present its most extensive collection of new and proven products at the largest international air show in Paris, June 19-25 ...
W. L. Gore & Associates, Inc.
Jun 16, 2017
Intelligent consumable and tool dispensers for e-commerce and Industry 4.0
The smart automatic vending machine has everything under control: valuable tools or equipment are securely stored in separate drawer partitions. Electromechanically ...
Bedrunka+Hirth
Jun 15, 2017
KYZEN to Show Cleaner for Cu Pillar Flip Chip Applications at SEMICON West
KYZEN announced plans to exhibit at SEMICON West, in booth #6072, taking place July 11-13, 2017 at the Moscone Center in San Francisco, CA. The KYZEN booth will feature ...
KYZEN
Jun 15, 2017
Nordson to Showcase Its Market-Leading Test &Inspection Systems at SEMICON West
Nordson DAGE and Nordson YESTECH announce plans to exhibit in Booth #5644 at SEMICON West, scheduled to take place July 11-13, 2017 at the Moscone Center in San Francisco ...
Nordson DAGE and Nordson YESTECH
Jun 15, 2017
Virtual Industries Brings Smart Handling Solutions to SEMICON West
Virtual Industries Inc. announced that it will exhibit in Booth #7313 at SEMICON West, scheduled to take place July 11-13, 2017 at the Moscone Center in San Francisco ...
Virtual Industries Inc.
Jun 14, 2017
ZEISS Highlights New and Enhanced Microscopes and Imaging Solutions at SEMICON West
ZEISS announces they will be highlighting a range of microscopes and imaging solutions at SEMICON West 2017, July 12-14, 2017, at the Moscone Center, San Francisco ...
ZEISS
Jun 14, 2017
Imec demonstrates for the first time sub-10nm germanium gate-all-around devices
At this week's 2017 Symposia on VLSI Technology and Circuits, imec unveiled new process improvements for next-generation devices. For the first time, scaled ...
Imec
Jun 14, 2017
W. L. Gore & Associates Introduces New Gore® Phaseflex® Microwave/RF Test Assemblies
W. L. Gore & Associates has introduced the new GORE® PHASEFLEX® Microwave/RF Test Assemblies, Type 0N for High Density Test/Interconnection - a lightweight assembly ...
W. L. Gore & Associates