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Jun 22, 2017
75GHz Clamshell Socket for NXP's FCPBGA
Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications. ...
Ironwood Electronics
Jun 22, 2017
MicroAssembly Tech presents the new Crossover, Model 6200 Table-Top Die Attach System, at Semicon West
MicroAssembly Technologies (MAT) is proud to present for the first time in the USA the new Crossover, Model 6200, Die Attach System. The Crossover is a state of the art ...
MicroAssembly Technologies, Ltd.
Jun 21, 2017
Advanced packaging brings more value and cost reduction to future semiconductor products
Yole confirms the consolidation of the advanced packaging industry, that is showing a steady growth between 2016 and 2022 in revenue. Advanced packaging is showing ...
Yole Développement
Jun 21, 2017
North American Semiconductor Equipment Industry Posts May 2017 Billings
North America-based manufacturers of semiconductor equipment posted $2.27 billion in billings worldwide in May 2017 (three-month average basis), according to the May ...
Jun 21, 2017
Presto Engineering Launches New Image Sensor Turnkey Services
Presto Engineering Inc. now offers a turnkey industrialization service for image sensors. The industry has experienced an increase in demand for these sensors, which are ...
Presto Engineering
Jun 21, 2017
Delphon to Showcase Custom Films for FHE at FLEX
Delphon will be showcasing its custom films for Flexible Hybrid Electronics (FHE) at the upcoming FLEX 2017 show June 19-22 in Monterey, CA. Delphon's in-house R&D ...
Jun 20, 2017
SEMICON West to Highlight China Growth Surge
SEMI announced the addition of a new high-profile program on China to its 2017 conference lineup for SEMICON West (July 11-13). Slated for July 11 at San Francisco's ...
Jun 20, 2017
Amkor Recognized as Supplier of the Year for Second Consecutive Year by Qualcomm
Amkor Technology Inc. announced it has been recognized as Supplier of the Year for 2016 by Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated. The award ...
Amkor Technology, Inc.
Jun 20, 2017
Gore SKYFLEX™ Aerospace Materials Among Key Solutions In COMAC C919 First Flight
The inaugural flight of the C919, China's first domestically produced single-aisle passenger jet, has ushered in a new level of technological advancement and production efficiency ...
W. L. Gore & Associates Inc.
Jun 20, 2017
Leti to present keynote on security challenges in the Internet of Things era at DAC
Leti will present a keynote address on embedded systems and the "Challenges of the Emerging IoT Security Arena" at DAC 2017, the design automation conference at the Austin ...