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Mar 19, 2018
EV Group and IBM Sign License Agreement on Laser Debonding Technology
EV Group and IBM announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM's patented Hybrid Laser ...
EV Group
Mar 19, 2018
Imec Honors Qualcomm Founder Irwin M. Jacobs with Lifetime of Innovation Award
Imec presented its annual Lifetime of Innovation Award to Dr. Irwin Jacobs, Founding Chairman and CEO Emeritus of Qualcomm. The annual industry honor is presented ..
Mar 16, 2018
GLOBALFOUNDRIES Extends Silicon Photonics Roadmap to Meet Explosive Demand for Datacenter Connectivity
GLOBALFOUNDRIES revealed new details of its silicon photonics roadmap to enable the next generation of optical interconnects for datacenter and cloud applications. ...
Mar 16, 2018
Well established advanced packaging manufacturer in Taiwan selects Trymax
Trymax Semiconductor Equipment BV announced that a Taiwanese establishes advanced packaging manufacturer selects Trymax for their new advanced packaging technology. ...
Trymax Semiconductor Equipment
Mar 16, 2018
Multitest Sensor Test Modules Ready for Increased Productions Needs
Multitest has now launched the next generation of its 6DOF gyro test module for singulated packages, which provides significant production benefits resulting in even ...
Multitest Elektronische Systeme GmbH
Mar 16, 2018
3D-Micromac Unveils Clean Scribe Technology for Low-Cost, Particle-Free Dicing of Silicon Carbide Wafers
3D-Micromac AG medical device and electronics markets, today unveiled its Clean Scribe technology, a new patent-pending feature for its microDICE™ laser ...
Mar 15, 2018
Indium Corporation's Andy Seager Named European Sales Manager
Based in Milton Keynes, United Kingdom, Seager is responsible for developing and implementing sales strategies for all solder products in Europe. As a member of the European sales leadership ...
Indium Corporation
Mar 15, 2018
Atotech presents new solutions for (a)mSAP applications at CPCA 2018
Atotech confirmed to showcase its latest solutions for (a)mSAP application at the upcoming CPCA show in Shanghai, China, from March 20 through 22, 2018. The company has developed ...
Mar 15, 2018
Palomar Tech Introduces 6532HP: Ultra High Accuracy Die Bonding System
Palomar Technologies, Inc. is delighted to announce the introduction of their newest die bonding system: the 6532HP (HP for High Precision, High Production, High Performance). ...
Palomar Technologies, Inc.
Mar 15, 2018
Apple selected substrate-like PCBs for its latest iPhones. Who's next?
The semiconductor industry's trends are affecting the semiconductor package and package-to-board interconnect level. Performance-driven applications like PCs and ...
Yole Développement