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Feb 2, 2018
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting ...
Master Bond
Feb 1, 2018
Boston Semi Equipment Develops Custom Automation Modules for Strip Handling Equipment
Boston Semi Equipment (BSE) announced that it has started shipping units of its new strip load/unload module to a top 10 semiconductor manufacturer. The automation ...
Boston Semi Equipment
Feb 1, 2018
Largest SEMICON Korea Ever Highlights Smart Manufacturing, Automotive
SEMICON Korea 2018 opens at COEX in Seoul today with its largest-ever exhibition and an expected 50,000 attendees at the premier event for the Korean semiconductor ...
SEMI
Jan 31, 2018
Electronics Manufacturing in Critical Need of New Talent
SEMI announced an urgent call to action to overcome the pressing semiconductor industry challenge of recruiting new talent. In a letter to the CEOs of more than 2,000 ...
SEMI
Jan 30, 2018
MacDermid Enthone Electronics Solutions to exhibit at 2018 IMAPS Device Packaging Show
MacDermid Enthone Electronics Solutions (MEES) will exhibit at the IMAPS Device Packaging show being held in Fountain Hills, Arizona, March 6-7, 2017. MacDermid Enthone's ...
MacDermid Enthone Electronics Solutions
Jan 29, 2018
USI Expands Installed Base of Precision Coating Technology in Asia
Ultrasonic Systems, Inc. (USI) announced it has expanded its installed base of fuel cell coating systems in Asia. Companies in Shanghai, Chengdu, and Shenzhen, China ...
Ultrasonic Systems, Inc.
Jan 26, 2018
aveni® S.A. Announces Breakthrough Electrical Yield Results for 12:1 TSVs
aveni S.A. announced that CEA-Leti has successfully fabricated TSVs at an unprecedented 12:1 aspect ratio and achieved 100% electrical yield using aveni's Rhea copper ...
aveni® S.A.
Jan 26, 2018
3D-Micromac, TDMDA and MOS Technology Host International Laser and Coating Symposium 2018
3D-Micromac AG in cooperation with the Taiwan Flat Panel Display Materials and Device Association (TDMDA) and MOS Technology, will host the 6th International Laser ...
3D-Micromac
Jan 25, 2018
Attend the IEW -- for Discussions on ESD with Colleagues
Register today for the 12th Annual International Electrostatic Workshop (IEW) being held May 14-18, 2018 at the Priorij Corsendonk, Oud Turnhout, Belgium. The IEW facilitates ...
EOS/ESD Association, Inc
Jan 25, 2018
North American Semiconductor Equipment Industry Posts December 2017 Billings
North America-based manufacturers of semiconductor equipment posted $2.39 billion in billings worldwide in December 2017, according to the November Equipment Market ...
SEMI