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Corporate news releases from manufacturers, supplies, and organizations supporting semiconductor packaging.
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Corporate News
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Jan 28, 2010
Questar Automatic Wire Bonders: Where Productivity Meets Affordability
Since 1984, Questar has been providing wire bonding machines to the global automated assembly market. Today, Questar fine-pitch automatic ...
Questar Products International, Inc.
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Jan 27, 2010
Questar Gold Ball Bonder Simplifies Set-up, Changeover
Questar Products International has developed a fine-pitch, fine-wire (17µ-75µ), automatic gold ball bonder designed specifically to meet today's ...
Questar Products International
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Jan 27, 2010
Survey Shows Concerns Over Copper Usage In Semi Packaging
World Gold Council (WGC) has welcomed the results of a survey, conducted by SEMI, the global semiconductor industry association, which shows the ...
World Gold Council
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Jan 27, 2010
UAT Develops Stress Buffer to Protect Semi Device Features
Unisem Advanced Technologies (UAT) announced that it has developed a methodology for creating a stress buffer to protect delicate features ...
Unisem Advanced Technologies
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Jan 26, 2010
Major step towards low-power all-optical switching for optical communications
The January issue of the premier scientific magazine Nature Photonics publishes an ultra-small and fast, electrically pumped all-optical ...
IMEC
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Jan 26, 2010
R&D Circuits Adds 2nd Shift to their Assembly Operation
R&D Circuits has announced that it is adding a 2nd shift to its assembly operation, which is expected to be fully staffed and operational in ...
R&D Circuits
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Jan 26, 2010
New Mini-Angular Grippers from Techno-Sommer
Techno-Sommer Automatic is proud to announce the newly expanded line of MGW800 Series Miniature Angular Grippers designed for use in small ...
Techno-Sommer Automatic
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Jan 25, 2010
GenISys to Enhance Layout BEAMER and Layout LAB
GenISys GmbH announced an agreement with Juspertor UG that will significantly enhance its existing Layout BEAMER™ and Layout LAB™ products ...
GenISys GmbH
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Jan 25, 2010
Vi TECHNOLOGY is rewarded by Frost & Sullivan
Vi TECHNOLOGY is honored to receive the prestigious Frost & Sullivan 2009 North American AOI Equipment Customer Value Enhancement Award for its ...
Vi TECHNOLOGY
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Jan 25, 2010
Presto Engineering Receives Venture Funding
Presto Engineering Inc. announced it has received $2 million in funding to support its expansion and future growth in Europe. The investment ...
Presto Engineering Inc.
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