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Oct 20, 2017
New SEMI Market Research Report: China IC Industry Outlook
SEMI announced its new China IC Industry Outlook Report, a comprehensive report for the electronics manufacturing supply chain. With an increasing presence ...
Oct 20, 2017
VERMES Microdispensing opens new Premises in Malaysia
VERMES Microdispensing announced it has opened its new corporation, VERMES Microdispensing Sdn Bhd, in Penang state, Malaysia. With this move the German-based company ...
VERMES Microdispensing
Oct 19, 2017
Holst Centre, imec and Philips demo world's first curved, plastic photodetector
Researchers from Holst Centre, imec and Royal Philips have produced the first ever prototype of a curved photodetector on a plastic substrate. The breakthrough paves ...
Holst Centre
Oct 19, 2017
ams audio chips offer noise-cancelling performance in two new wireless headphones
ams announced that headphone manufacturer FIIL is using two ams chipsets in its latest releases. ams' hybrid Active Noise Cancellation (ANC) audio IC, the AS3435 ...
ams AG
Oct 19, 2017
Thalia DA attracts fresh investment as semi industry recognizes analog IP reuse challenge
Thalia Design Automation announced the completion of a $865k funding round that will allow it to drive market uptake of its innovative methodology solutions for analog ...
Thalia Design Automation
Oct 18, 2017
Wafer Shipments Forecast to Increase in 2017, 2018 and 2019
SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This SEMI forecast provides an outlook for the demand in silicon units ...
Oct 18, 2017
StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
StratEdge Corporation announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz ...
StratEdge Corporation
Oct 18, 2017
ClassOne's New Integrated Financing Streamlines Equipment Purchasing
ClassOne Group announced a special new financing program that seeks to give more attractive options to equipment purchasers. ClassOne stated that the new financing ...
Oct 17, 2017
Nordson DAGE to Discuss Its Wafer X-ray Metrology Platform at IWLPC
Nordson DAGE announces plans to exhibit at the 14th annual International Wafer-Level Packaging Conference (IWLPC) Expo, scheduled to take place Oct. 24-26, 2017 in San Jose, CA ...
Nordson DAGE
Oct 17, 2017
Advantek, Inc. Launches New Enhanced Website
Advantek launches a newly redesigned website. The enhanced site focuses on Advantek's extensive expertise in carrier tape, and ability to provide customers the exact ...