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Oct 26, 2017
aveni® S.A. Raises $10.5M to Commercialize its Innovative Metallization Technologies
aveni S.A. announced it has completed a $10.5M capital raise from Merck Ventures, the corporate venture arm of Merck, along with existing investors. "This new ...
aveni S.A.
Oct 26, 2017
The automotive electronics industry explodes: when cars become smarter...
For years, the automotive electronics industry has been undergoing a massive transformation, not seen since its creation more than 100 years ago. Autonomous driving ...
Yole Développement
Oct 25, 2017
Dow Corning® TC-5888 Thermally Conductive Compound Improves Production, Performance and Reliability
Dow Corning introduced new Dow Corning® TC-5888 Thermally Conductive Compound. The latest addition to the Company's broad and growing portfolio of solutions for thermal ...
Dow Corning
Oct 25, 2017
UnitySC Announces Opening of Austin Global Software Development Center
UnitySC announced at the International Wafer Level Packaging Conference (IWLPC) in San Jose, Calif., the opening of Unity Semiconductor Inc., the company's new global ...
Oct 25, 2017
EMS Launches Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging
Engineered Material Systems, Inc. is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level ...
Engineered Material Systems, Inc.
Oct 24, 2017
North American Semiconductor Equipment Industry Posts September 2017 Billings
North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in September 2017 (three-month average basis), according to the ...
Oct 24, 2017
SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-WB51 with superior spray uniformity, excellent soldering performance and ...
SHENMAO Technology, Inc.
Oct 23, 2017
Stamped Spring Pin Socket for BGA293
Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for Micro Controller Units - CBT-BGA-6071. The contactor is a stamped ...
Ironwood Electronics
Oct 23, 2017
Emerging 5G wireless communication standard is bringing disruption from services to technology and supply chain
The 5th generation of cellular networks is anticipated to arrive in the timeframe of the next 2-5 years, enabling Gbps datarates and a plethora of new applications ...
Yole Développement
Oct 20, 2017
Technic Releases Elevate® Cu 2000
Technic announces the introduction of Elevate®Cu 2000, an innovative, high-speed acid copper plating system specifically formulated for Fan-Out Wafer Level ...