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May 21, 2018
3D-Micromac Receives Order for New microMIRA Excimer Laser Lift-off System from dpiX
3D-Micromac AG announced it has received an order for the company's new microMIRA excimer laser lift-off (LLO) system from dpiX, a leading manufacturer of high-res ...
3D-Micromac
May 21, 2018
Orbotech and IME to develop advanced packaging solutions in FOWLP Joint Lab
Orbotech's partnership with IME includes the integration of Orbotech's Emerald™ UV Laser Drilling solution into IME's Development Line to develop Fan-Out Wafer Level ...
Orbotech
May 21, 2018
UV LED industry: over 10-years development, market share has trebled
Yole Développement has now been following the UV LED industry for 10 years by developing a strong expertise related to the technology evolution, the competitive ...
Yole Développement
May 18, 2018
Presto Engineering Joins GLOBALFOUNDRIES Ecosystem as ASIC Partner
Presto Engineering Inc. announced that it has joined GLOBALSOLUTIONS®, GF's ecosystem of partners that provides services from conception to production. As an ecosystem ...
Presto Engineering Inc.
May 18, 2018
First Qtr 2018 Silicon Wafer Shipments Increase Quarter-Over-Quarter to Record Level
Reaching their highest recorded quarterly level ever, worldwide silicon wafer area shipments jumped to 3,084 million square inches during the first quarter 2018 ...
SEMI
May 18, 2018
Meyer Burger awarded two contracts for its DS 261 wire saws
Meyer Burger Technology Ltd announced the successful conclusion of repeat orders from two existing customers for its versatile DS 261 wire saw equipment for slicing ...
Meyer Burger Technology Ltd
May 17, 2018
EV Group Secures Lithography Order from VTT for 'More than Moore' Applications
EV Group (EVG) announced that it has received an order for its EVG®120 automated resist processing system from VTT Technical Research Centre of Finland (VTT). An ...
EV Group
May 17, 2018
DfR Solutions Addresses Mission-Critical Impact on Electronics Reliability
DfR Solutions announced that Dr. Craig Hillman, CEO of DfR Solutions is speaking at the IPC High Reliability Forum for Mil-Aero and Automotive Sectors in Linthicum ...
DfR Solutions
May 17, 2018
UnitySC Opens New Asia Entity to Support Advanced Packaging and Power Device Markets
UnitySC announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia). The entity was established to deliver enhanced customer ...
UnitySC
May 16, 2018
Carl Zeiss Meditec increased revenue in first six months of 2017/18 by 4.5%
Carl Zeiss Meditec AG enjoyed further growth in the first six months of 2017/18, despite negative currency effects: Revenue increased by 4.5% (adjusted for currency ...
Carl Zeiss Meditec