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Mar 21, 2018
Apple grabs two-year lead in 3D sensing race
Most Android phones will have to wait until 2019 to duplicate the 3D sensing feature behind Apple's Face ID security, ...
Reuters
Mar 21, 2018
KLA-Tencor Buys Israel-based Orbotech for $3.4 Billion
Chip equipment vendor KLA-Tencor is set to acquire Israel-based Orbotech for $3.4 billion in a move that the firm says ...
EE Times
Mar 21, 2018
China versus USA in AI potential
China's success in building supercomputers demonstrates its potential to catch-up to world leaders in AI hardware. One metric that demonstrates ...
Next Big Future
Mar 21, 2018
Mobile World Congress 2018: The Tangled Fate of Graphene and 5G
Graphene has been heralded as a "wonder material" for well over a decade now, and 5G has been marketed as ...
IEEE Spectrum
Mar 20, 2018
Wafer Demand: Under Pressure But Still Growing
Wafer demand grew 10.7% in 2017 while total semiconductor units grew 13.4%. Due to the tight supply of silicon wafers ...
Semiconductor Engineering
Mar 20, 2018
The Tangled Fate of Graphene and 5G
Graphene has been heralded as a "wonder material" for well over a decade now, and 5G has been marketed as ...
IEEE Spectrum
Mar 20, 2018
EUV's New Problem Areas
Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations--also known as stochastic effects--are resurfacing and creating ... ...
Semiconductor Engineering
Mar 20, 2018
Chip gear maker KLA-Tencor to buy Orbotech for $3.4 billion
KLA-Tencor Corp said it would buy fellow semiconductor equipment maker Orbotech Ltd in $3.4 billion deal, giving it access to ...
Reuters
Mar 20, 2018
SoftBank could relist British chip designer ARM
SoftBank Group Corp could relist ARM Holdings, the British chip designer it bought two years ago, according to a senior ...
Reuters
Mar 20, 2018
New Xilinx CEO Touts 'Adaptive Computing'
Less than two months after taking the reigns at Xilinx, Victor Peng outlined a new strategy for the programmable logic ...
EE Times