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Aug 8, 2017
Esgee Technologies Releases OverViz 2.2 for Solving Hybrid Plasma-Fluid-Electromagnetic-Particle Simulations
Esgee Technologies Inc. is excited to announce the release of OverViz Simulation Suite v2.2. OverViz is a validated multiphysics tool suite that provides industry leading ...
Esgee Technologies Inc.
Aug 8, 2017
Nanusens solves the problem of stiction in MEMS inertial sensors
Nanusens has announced that its CMOS nano-sensor technology has been successfully used to solve the problem of stiction in MEMS inertial sensors, which is a major ...
Nanusens
Aug 7, 2017
EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan
EV Group (EVG) announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama ...
EV Group
Aug 7, 2017
Advances in Thin, 3D and MEMS Die Bond Strength Testing
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond ...
XYZTEC BV
Aug 7, 2017
SiC technologies adoption is going to accelerate with a tipping point in 2019
SiC power business is concrete and real, with a promising outlook... That is what Yole Développement's analysts said in 2016. The trend has not changed in 2017 ...
Yole Développement
Aug 4, 2017
Multitest MiCon® Contactor: Advantages of Cantilever Design for MCU and ASIC Testing
Multitest recently launched the MiCon contactor. The MiCon leverages the industry-proven Cantilever technology for the final test of Microcontrollers, Industrial DSPs ...
Multitest
Aug 4, 2017
Keysight Tech Collaborates with Sequans to Provide NB-IoT, LTE Cat-M1 Test Solutions
Keysight Technologies, Inc. announced an agreement with Sequans Communications whereby Keysight will use Sequans' Monarch LTE for IoT chip platform to provide support ...
Keysight Technologies
Aug 4, 2017
Rudolph Expands in China for AMOLED Panel Lithography
Rudolph Technologies, Inc. announced that it has received an order for a JetStep® G lithography system from a second customer in China for pilot line manufacturing ...
Rudolph Technologies, Inc.
Aug 3, 2017
Amkor Technology Reports Financial Results for the Second Quarter 2017
Amkor Technology, Inc. announced financial results for the second quarter ended June 30, 2017. "Second quarter revenues were up 8% sequentially," said Steve Kelley, Amkor's ...
Amkor Technology, Inc.
Aug 3, 2017
SiC technologies adoption is going to accelerate with a tipping point in 2019
Woodside Capital Partners International LLC and Yole Développement SA announce a joint venture. Yole will serve as a research partner for Woodside Capital's M&A advisory ...
Yole Développement