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Mar 2, 2018
ClassOne Equipment Selected to Upgrade Major UK Fab
ClassOne Equipment has announced the sale of multiple systems to a major global components manufacturer as part of a significant upgrade to their UK fab. Semitool ...
ClassOne Equipment
Mar 1, 2018
Imec Announces Advances in EUV Lithography
Imec continues to advance the readiness of EUV lithography with particular focus on EUV single exposure of Logic N5 metal layers, and of aggressive dense hole arrays ...
imec
Mar 1, 2018
Inova Semiconductors announces standalone LED driver for in-car lighting
Inova Semiconductors announces a new standalone smart RGB LED driver and controller, the INLC100Q16. This is the latest member of Inova's ISELED family, a truly revolutionary ...
Inova Semiconductors
Mar 1, 2018
ISELED Alliance accelerates automotive LED light design with new evaluation kit
The ISELED Alliance launches a new evaluation kit for ISELED, a digital smart RGB LED solution for automotive ambient lighting. The evaluation kit allows developers ...
ISELED Alliance
Mar 1, 2018
10nm pattern generation using thermal scanning probe lithography enabled by simplified materials and processes
Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive ...
PiBond
Feb 28, 2018
UTAC delivers high-density System in a Package (SiP) Service for Octavo Systems
UTAC Holdings Ltd through ongoing investments in its Dongguan facility, is now enabled with capabilities to serve the most demanding System in a Package (SiP) ...
UTAC
Feb 28, 2018
52 GHz Bandwidth Socket for BGA228 Package
Ironwood Electronics has recently introduced a new high performance elastomer socket for 0.65mm pitch BGA package. The SG25-BGA-2045 socket is designed for a 11mmx11mm ...
Ironwood Electronics
Feb 28, 2018
North American Semiconductor Equipment Industry Posts January 2018 Billings
North America-based manufacturers of semiconductor equipment posted $2.36 billion in billings worldwide in January 2018, according to the January Equipment Market ...
SEMI
Feb 27, 2018
Peter Trefonas Elected SPIE Fellow
Peter Trefonas, Ph.D., corporate fellow in Dow Electronic Materials, has recently been elected a Fellow of SPIE, for achievements in design for manufacturing and compact ...
Dow Electronic Materials
Feb 27, 2018
SEMI Showcases Achievements in Flexible Hybrid Electronics, MEMS and Sensors at 2018FLEX and MSTC Conferences
A global gathering of more than 650 industry and academic experts, including 140 speakers and 56 exhibitors, shared the latest advancements in both flexible hybrid ...
SEMI