We search for industry news, so you don't need to.
Press Releases arrow   Page 25 of 484   arrow
Submit a Press Release
Mar 7, 2018
Leti and Mapper Develop Individualized Chips With Maskless Lithography In CMOS Process
Leti and Mapper Lithography announced a low-cost cyber-security breakthrough that encrypts individual chips with a code. The non-falsifiable code is generated by ...
Leti
Mar 6, 2018
TechSearch International Analysis Shows Packaging for Cryptocurrancy Provides a Windfall
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip chip CSPs and BGAs is expected to provide increased ...
TechSearch International
Mar 6, 2018
StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference
StratEdge Corporation announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference ...
StratEdge Corporation
Mar 6, 2018
Atotech's MultiPlate® for FOPLP at IMAPS Device Packaging Conference
At the upcoming IMAPS Device Packaging Conference 2018, Atotech will speak about the move from Fan Out Wafer Level Packaging (FOWLP) to Fan Out Panel Level Packaging ...
Atotech
Mar 5, 2018
Imec and Cadence Tape Out Industry's First 3nm Test Chip
Imec, and Cadence Design Systems, Inc. announced that its extensive, long-standing collaboration has resulted in the industry's first 3nm test chip tapeout. The tapeout ...
Imec
Mar 5, 2018
UTAC Named Winner of Supply Chain Management Award by Panasonic Corporation
UTAC was one of five companies recognised and the first OSAT to be granted the Panasonic Outstanding Supply Chain Management (SCM) award. UTAC contributed by ...
UTAC Holdings Ltd
Mar 5, 2018
Coventor Adds Device Analysis Capabilities to SEMulator3D 7.0
Coventor, Inc. announced the availability of SEMulator3D® 7.0 - the newest version of its semiconductor virtual fabrication platform. With added features, performance ...
Coventor, Inc.
Mar 2, 2018
Brewer Science's OptiLign™ DSA Product Family Provides an Alternative for Advanced-Node Wafer Patterning
Brewer Science, Inc., from SPIE Advanced Lithography 2018 introduced its OptiLign™ commercial-quality directed self-assembly (DSA) material set developed in collaboration ...
Brewer Science, Inc.
Mar 2, 2018
Indium Features Gold Alloy Solder Preforms at SPIE Defense + Commercial Sensing Expo
Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Defense + Commercial Sensing Expo, April 15-19, in Orlando, Fla. Depending on the alloy ...
Indium Corporation
Mar 2, 2018
Bosch Sensortec launches high performance barometric pressure sensor BMP388 for CE drones
Bosch Sensortec introduces a new high performance barometric pressure MEMS sensor: the BMP388 is ideally suited for altitude tracking in Consumer Electronics ...
Bosch Sensortec